Dear Friends,

Over the coming weeks and months, my team and I will be fully focused on the Wide Bandgap Event in Munich. As you may have seen, we'll be returning to the Hilton Munich Airport on December 2-3.

Preparations are already in full swing, and many of the limited exhibition tables have already been booked. So, if you're planning to showcase your latest products or innovations to the WBG community, don't wait too long! Sponsorships, on the other hand, are not limited - and they come with some attractive benefits, including two free tickets. Get in touch with us at info@bodoswbg.com to learn more!

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.

Kind Regards,

Bodo Arlt
editor@bodospower.com

Live webinar: Quantifying the benefits of SiC technology in Electric Motor Drive Systems
This webinar on July 3 delves into the evolving regulatory landscape and the technical innovations driving more efficient Power Drive Systems (PDS) designs. Join our exclusive webinar to explore the potential of SiC in replacing traditional IGBT technology for motor drives.
infineon.com

Launch of Energy Storage Resource Hub
Arrow Electronics has launched a dedicated online hub offering extensive resources for those seeking to understand the future of energy storage systems. As the global shift towards renewable energy accelerates, battery energy storage systems (BESS) are becoming critical in revolutionising energy storage and management.
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Sales Office in Shanghai opened
Danisense has recently opened a sales office in Shanghai, China to be closer to the Asian market and to be able to serve and support its growing Asian customer base locally. The office is being headed up by General Manager Siyu Yan, who benefits from more than 15 year years' experience in the electronics and Test & Measurement sector.
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Collaboration on Next-Generation Integrated Power Delivery Solution for AI and Cloud Platforms
Empower Semiconductor announced a collaboration with Marvell Technology to develop optimized integrated power solutions for Marvell® custom silicon platforms. These solutions are designed to accelerate the transformation of power delivery systems to smaller, faster, integrated power silicon chips tightly coupled with the processor.
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Cooperation on Power Semiconductors for HVDC Transmission Systems
Mitsubishi Electric Corporation announced that it has signed a memorandum of understanding (MOU) with GE Vernova, headquartered in Cambridge, Massachusetts, USA, to strengthen their cooperation on power semiconductors for high-voltage direct-current (HVDC) transmission systems.
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The EU Energy Label for Mobile Devices
A new energy label for mobile devices is mandatory in the EU starting June 20, 2025. This applies to all smartphones and tablets with Android or iPadOS operating systems, ushering in a new era of European product policy.
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Expert to Present on Automotive and Industrial Solder Bonding Solutions at IPC Workshop
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the IPC Component-to-System Level Packaging Workshop, scheduled for July 2-3, 2025, in Berlin, Germany.
electronics.org

Battery Cells & Systems Expo, Birmingham, UK, July 8-10 batterysystemsexpo.com

3D PEIM, Golden, CO, USA, July 8-10 3d-peim.org

Vehicle Electrification Expo, Birmingham, UK, July 9-10 ve-expo.com

The Battery Show Asia, Hong Kong, China, July 15-17 thebatteryshow.asia

Mobility Tech Asia, Hong Kong, China, July 15-17 mobilitytech.asia

IEEE PEDS, Penang, Malaysia, July 21-24 ieee-peds.org

IEEE IPFA, Penang, Malaysia, August 5-8 ipfaieee.org

World Battery & Energy Storage Industry Expo, Guangzhou, China, August 8-10 battery-expo.com

EMC+SIPI, Raleigh, NC, USA, August 18-22 emc2025.org

The smarter E South America, Sao Paulo, Brazil, August 26-28 thesmartere.com.br

Power Supplies for Communications, Industrial, and Defense Applications
P-DUKE's TBF500 family of AC/DC power supplies support a universal input voltage range from 85 to 264 VAC and are available with output voltages of 12, 15, 24, 28, 48, and 54 VDC. All members of the family offer a low 0.6 W power consumption under no-load conditions (no minimum load is required) and support up to 500 W loads with up to 93% power conversion efficiency. With 3,000 VAC reinforced insulation, TBF500 devices are presented in the form of a sealed power brick containing active semiconductor components with an integrated thermally conductive aluminum base plate.
Read more ...

High-Voltage Battery Sensor combining Shunt and Hall Effect Technologies
LEM has launched a current sensing unit for battery management in electric vehicles (EVs). For the first time on the market, LEM has put together shunt and open-loop Hall effect technologies in a single part, called Hybrid Supervising Unit (HSU), to meet the challenges of small footprint, low cost and highest safety level in EV battery management systems.
Read more ...

25 V MOSFET in DFN3.3x3.3 meets Power Demands in AI Servers
Alpha and Omega Semiconductor introduced its AONK40202 25V MOSFET in DFN3.3x3.3 Source-Down packaging technology. Designed for high power density in DC/DC applications, the device provides features that meet the requirements of AI servers and data center power distribution.
Read more ...

GaN Inverter Brings GaN Power to Medium-Voltage Motor Drives
Efficient Power Conversion Corporation (EPC) released the EPC9196, a high-performance 25 A_RMS, 3-phase BLDC motor drive inverter reference design powered by the EPC2304 eGaN® FET.
Read more ...

Tab Terminal, High Voltage DC Switching Relay
FCL Components has released the FTR-E1J 20A, a tab terminal-type high voltage DC switching relay, based on its FTR-E1 series. It is screw mounted and does not use printed circuit boards.
Read more ...

Power Inductors in a Performance Version
The WE-XHMI Performance series extends Würth Elektronik's family of power inductors with improved versions in sizes 1010, 1060, 6030, and 6060. The magnetically shielded flat-wire inductors support high saturation currents while reducing DC.
Read more ...

"World's First 10 µF / 50 V_DC MLCC in 0805-inch Size for Automotive Applications"
Murata has announced the GCM21BE71H106KE02 multilayer ceramic capacitor (MLCC) has entered mass production. The device is "the world's first 0805-inch size (2.0mm x 1.25 mm) MLCC to offer a capacitance of 10 µF with a 50 V_DC rating and is specifically engineered for automotive applications".
Read more ...

Isolated Gate Driver IC Optimized for High-Voltage GaN Devices
ROHM has developed an isolated gate driver IC – the BM6GD11BFJ-LB. It is designed specifically for driving HV-GaN HEMTs. When combined with GaN devices, this driver enables stable operation under high-frequency, high-speed switching conditions – contributing to greater miniaturization and efficiency in high-current applications such as motors and server power supplies.
Read more ...

eBook on High-Density Power Modules for 48 V
Vicor explains in their latest eBook how its power solutions support customers that are constantly pushing the limits of what is possible. This exclusive read entitled 'Changing what's Possible' delves into how power dense Vicor modules enable many world-changing innovations across various sectors, including electric vehicles, renewable energy and advanced computing, all of which are adopting 48 V architecture.
Read more ...

Off-the-Shelf Radiation-Hardened 15 W DC/DC Power Converter for Space Applications
Microchip Technology announced the SA15-28 off-the-shelf radiation-hardened DC/DC 15 W power converter with a companion SF100-28 EMI filter that are designed to meet MIL-STD-461 specifications.
Read more ...

"MLCCs with the Industry's highest Capacitance at 100 V for Commercial Applications in the 1608 Case Size"
TDK Corporation has expanded its C series for commercial multilayer ceramic capacitors (MLCCs) to 1 µF at 100 V in the 1608 size (1.6 mm x 0.8 mm x 0.8 mm – L x W x H), with X7R characteristics.
Read more ...

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