Dear Friends,

Now we can count the last few days before we meet in Nuremberg for PCIM.
PCIM Europe is the most important conference for Power Electronics in Europe.
I am looking forward to seeing my friends from industry and academia in Nuremberg!

For online information and my archive go to my website www.bodospower.com.
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The magazine is directed to the education of young engineers and to those veterans who must keep up with progress in technology. There is no better way to communicate. We all share one world. As a publisher I serve the world: one magazine, on time, every time.

Best Regards,

Bodo Arlt editor@bodospower.com

Power Electronics are Back in the Bay April 20th !
The SFBAC IEEE Power Electronics Society (PELS) is very pleased to invite you a very special event in lieu of our April chapter meeting. We are hosting a full-day workshop devoted to Energy Harvesting (EH), which is a continuation in a series of special workshop events to be announced throughout the year. Event details, including details about the sessions and instructors, can be found below.
This event will also be co-sponsored by the UC Berkeley IEEE PELS-IAS Student Chapter.
http://ewh.ieee.org/r6/scv/pels/index.html

Smart Starts at SEMICON West
SEMICON West 2017 brings you the future as powered by microelectronics-enabled technologies. It connects the entire extended supply chain from materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as flexible hybrid electronics, MEMS and sensor, and more. The SEMI/Gartner symposium provides a midyear market update and interactive panel discussion. Visit 1100 exhibitors, partake of 115 hours of programs, and attend the enhanced networking events. July 11-13, San Francisco, CA.
http://www.semiconwest.org/?utm_source=bodospower&utm_medium=armktg&utm_term=04bpswtxtn

CTO Alexander Gerfer appointed to the Executive Board
Alexander Gerfer (51), CTO of the Würth Elektronik eiSos Group, has been appointed to the company's Executive Board. With immediate effect, together with the CEOs of the Würth Elektronik eiSos Group, Oliver Konz and Thomas Schrott, he would be co-responsible for the future strategies of one of Europe's largest suppliers of electronic and electromechanical components. Alexander Gerfer's appointment is an acknowledgment of his excellent services on behalf of the company.
http://www.we-online.com

Collaboration Sales in Japan
Rohm and Semikron will kick-off collaboration sales of SiC power devices and modules, to contribute to the innovative evolution of the Japanese power electronics market. Rohm has been a leading developer of advanced Silicon Carbide (SiC) products and SiC power devices in particular. Semikron is one of the market leaders in power modules, covering a wide range of packages for all applications.
http://www.semikron.com

Showcase Tabbing and Stringing Flux at SNEC PV Power Expo in Shanghai
Alpha Assembly Solutions will introduce their new ALPHA PV-38i Liquid Flux at the SNEC PV Power Expo taking place April 19th – 21st in Shanghai, China. ALPHA PV-38i Liquid Flux is the latest generation tabbing and stringing flux with the lowest level of solids in the industry.
http://www.AlphaAssembly.com

Ludger Trockel President of TDK Europe
TDK Corporation announces that effective April 1, 2017, Ludger Trockel (53) has been named President of TDK Europe GmbH, the company's European sales organization. He thus succeeds Rudolf Strasser (64), who has retired on March 31, 2017. TDK Europe's management team also includes Andreas Keller (47) and Josef Vissing (53).
http://www.tdk.com

ECPE Workshops
ECPE Workshop: Condition and Health Monitoring in Power Electronics
4 - 5 July 2017, Aalborg, Denmark
Chairmen: Prof. F. Blaabjerg (Aalborg University), Dr. S. Mollov (Mitsubishi Electric R&D Centre Europe), Dr. A. Rojko (ECPE)

ECPE Tutorial 'Power Semiconductor Devices & Technologies'
26 - 27 April 2017, Berlin, Germany
Chairmen: Dr. A. Mauder (Infineon), Prof. D. Silber (Univ. of Bremen)

ECPE Workshop 'EMC in Power Electronics: From Harmonics to MHz - Design for EMC and Fast Switching'
3 - 4 May 2017, Berlin, Germany
Chairmen: Prof. E. Hoene (Fraunhofer IZM), Dr. L. Dalessandro (Schaffner Group)

European PhD School on 'Power Electronics, Electrical Machines, Energy Control and Power Systems'
22 - 26 May 2017, Gaeta, Italy
Chairman: Prof. G. Tomasso (University of Cassino)

ECPE Tutorial 'Power Electronics Packaging'
21 - 22 June 2017, Würzburg, Germany
Chairmen: Prof. U. Scheuermann (Semikron), Dr. J. Popvic-Gerber (TU Delft)

ECPE Tutorial 'Thermal Engineering of Power Electronic Systems - Part I (Thermal Design and Verification)'
18 - 19 July 2017, Erlangen, Germany
Chairmen: Prof. U. Scheuermann (Semikron), D. Malipaard (Fraunhofer IISB)

ECPE Tutorial 'Thermal Engineering of Power Electronic Systems - Part II (Thermal Management and Reliability)'
10 - 11 October 2017, Nuremberg, Germany
Chairmen: Prof. E. Wolfgang (ECPE), Prof. U. Scheuermann (Semikron)

ECPE Tutorial 'Power Circuits for Clean Switching and Low Losses'
9 November 2017, Aalborg, Denmark
Chairman: Dr. R. Bayerer (Infineon)
http://www.ecpe.org

Sensors and Measurement: Turnover, Investments, and Exports Are Up
AMA Association for Sensors and Measurement (AMA) polled its members on the economic development during 2016. The sensor and measuring industry was able to maintain its successful growth in all segments. The AMA members anticipate a further growth in revenue of five percent and plan to invest another five percent, compared to the results of the previous year.
http://www.ama-sensorik.de

Revolutionizing the Semiconductor Purchasing Process
Microchip Technology Inc. debuted its updated, feature-rich and mobile-optimized e-commerce platform for purchasing microcontrollers, mixed-signal, analog, Flash-IP solutions and more. microchipDIRECT, which sells Microchip parts directly to customers, has been updated with several new mobile-accessible features that are now available for the first time in the semiconductor industry.
http://www.microchipdirect.com

Viewpoint
Again White Asparagus

Blue Product of the Month
tinyAVR MCUs Increase System Throughput While Lowering Power Consumption

Guest Editorial
Tipping Point for Wide Band Gap Technology Signals Start of Mainstream SiC Adoption

By Dr. Peter Wawer, Division President Industrial Power Control at Infineon Technologies AG

Cover Story
1200V CoolSiC MOSFET High Performance Complemented by High Reliability

The dedicated material properties of SiC enable the design of minority carrier free unipolar devices instead of the charge modulated IGBT devices. As such, they deliver highest efficiency, higher switching frequencies, reduced heat dissipation and space savings.
By Marc Buschkühle Infineon Technologies AG, Warstein

Market
Applied Power Electronics Conference and Exposition - APEC 2017

APEC, the premier annual event in applied power electronics enables power electronics professionals to meet, exchange the latest technical knowledge and develop valuable industry connections.
By Gary M. Dolny, Bodo’s Power Systems, gary.dolny.us@ieee.org

Technology
7th ECPE SiC & GaN User Forum

Potential of Wide Bandgap Semiconductors in Power Electronic Applications
By Andreas Lindemann, Otto-von-Guericke-University Magdeburg, Chair for Power Electronics, and ECPE European Center for Power Electronics e. V

Market
13th Battery Experts' Forum

International Setting of the Battery World Addressed Li-Ion Technology and E-Mobility
By Roland Ackermann, correspondent editor Bodo’s Power Systems

Embedded World
embedded world 2017 Consolidates its Role as Leading International Exhibition

In its 15th round, embedded world in Nuremberg, Germany, has once again impressively reinforced its status as the number one international gathering for the embedded system technology experts.
By Roland Ackermann, correspondent editor Bodo’s Power Systems

Driver ICs
Configurable Gate Drives for nHPD2

The nHPD2 package targeted at traction applications offers a number of advantages for the power stack designer, but also adds complexity in designing a gate drive that can be used to target the different options offered by the nHPD2 package.
By Bryn Parry, Amantys Power Electronics Limited & Chris White, Hitachi Europe Limited

IGBT & Diodes
High Humidity Robustness of ABB's IGBTs and Diodes

This article provides a brief insight into the latest generation of 6.5kV HiPak modules with reliable performance under extreme conditions, as demonstrated in the new THB-HVDC test.
By Charalampos Papadopoulos, Munaf Rahimo, Chiara Corvasce, Daniel Schneider, Rachid Jabrany, Neungho Shin, Karen Ruef, Claudia Widmer, Gontran Pâques, Maria Amongero, Chantal Toker-Bieri, Patric Strasser and Raffael Schnell, ABB

IGBT Modules
New Horizons in Thermal Cycling Capability Realized with the 7th gen. IGBT Module

The 7th gen. IGBT modules are based on the new SLC packaging technology with a material composition based on matching CTEs which result in the highest thermal cycling capability.
By Thomas Radke and Narender Lakshmanan Mitsubishi Electric Europe B.V

Driver IC
High-Voltage Isolated Gate Driver Module

The Goal is to Serve Motor Drives, Inverters, Converters, Medical, UPS, Traction and Industrial SMP Supply products that enable the shortest design cycle as well as the lowest design cost.
By Abdus Sattar Ph.D., and Leonid Neyman Ph.D., IXYS Corporation

IGBT Modules
7th-gen IGBTs – Three-level Modules for 1+ MW 1500 VDC Solar PV Central Inverters

The devices are able to handle 80+ kVA. The price gap between multi-string and central inverters is closing and the competition between these solutions is heating up for utility-scale applications.
By Guillem Gargallo, Product Marketing Manager, Vincotech GmbH, Unterhaching

Measurement
Closed Loop Current Transducers with Excellent Performance are also Cost-Effective.

Isolated current transducers use many different magnetic technologies varying from simple open-loop devices based on Hall cells to complex closed-loop transducers using fluxgates as the magnetically sensitive element. The higher accuracy of the more complicated types comes with an increased cost.
By Steve Moureaux, R&D Program Manager and Diego Gutierrez, Senior R&D Design Engineer, LEM

Inverter Design
Maximum Efficiency for Inverters

TDK has joined forces with Infineon Technologies to develop a design for xEV inverters that achieves a very high efficiency of over 98 percent over a power range of 10 kW to 150 kW. This success has been achieved by matching of the Infineon IGBT module and the EPCOS, TDK passive components.
By Tomas Reiter, Infineon AG and Wolfgang Rambow, EPCOS AG

DCDC Conversion
The Benefits of Bi-Directional Power Design

The "DC transformer" is a reality. Even more design freedom follows on the realisation that power flow through selected families of such devices can be fully reversible – they are bi-directional.
By Arthur Jordan, Principal Field Applications Engineer, Vicor

Thermal Management
Small Heat Loads; Big Challenge to enhance Heat Sink Performance?

When it comes to the optimisation of low power heat sinks, the challenges are as prominent as they are with multi- Kilowatt heatsinks. Performance gains are very hard to achieve and even harder to quantify as they are often only a fraction of a degree.
By Andreas Engelhardt, Business Development Manager, Columbia-Staver Ltd.

Technology
How GaN is Threatening the MOSFET's Crown

For more than 35 years, power MOSFETs have dominated the field of power converter design in the low to medium power range. This has been supported by continuous innovation.
By Francois Perraud, Team leader - Power and Automotive Solutions Semiconductors, Panasonic

MOSFETs
SiC MOSFETs in Optimized Packaging Deliver a 3× Reduction in Switching Losses

This article describes two packaging options, and shows how these products can be used to cut losses and simplify the design of a 20kW active front end targeted for off-board, EV fast charging.
By Edgar Ayerbe, Dr. Adam Barkley and Dr. John Mookken, Wolfspeed

Thermal Management
Water-Cooled Capacitor with Integration Technology

Integrated watercooled film capacitor is a good solution for ambient temperature application, meanwhile contributes to higher energy densities, higher thermal conductivities and better mechanical strength.
By David Ting, CTO and Eric Wong, CAE, EAGTOP, CHINA

Power Management
Power Path Management in Charger ICs

With DPPM, the system can obtain power immediately once the input source is applied, even with a deeply discharged battery. The system voltage regulation method is also discussed.
By Aaron Xu, MPS

SEMICON Southeast Asia, Penang, Malaysia, April 25-27 http://www.semiconsea.org

ExpoElectronica, Moscow, Russia, April 25-27 http://www.expoelectronica.ru

Energy Storage Forum, Berlin, Germany, May 8-12 http://www.energystorageforum.com

PCIM Europe, Nuremberg, Germany, May 16-18 http://www.mesago.de/en/PCIM/home.htm

SMT Hybrid, Nuremberg, Germany, May 16-18 http://www.mesago.de/en/SMT/home.htm

IWBGPEAW, Stockholm, Sweden, May 21-23 https://www.acreo.se/events/iwbgpeaw-2017-international-wide-bandgap-power-electronics-applications-workshop

Electric Machines and Drives, Miami, FL, USA, May 21-24 http://www.iemdc.org/

ISPSD Conference, Sapporo, Japan, May 28 - June 1 http://www.ispsd2017.com

Sensor+Test, Nuremberg, Germany, May 30 - June 1 http://www.sensor-test.de

Intersolar Europe, Munich, Germany, May 31 - June 2 http://www.intersolar.de/en/home.html

CWIEME, Berlin, Germany, June 20-22 http://www.coilwindingexpo.com/berlin/BPN

PCIM Asia, Shanghai, China, June 27-29 http://www.pcimasia-expo.com

SEMICON West, San Francisco, CA, USA, July 11-13 http://www.semiconwest.org

Thermal Management, Denver, Colorado, USA, August 9-10 http://www.thermalnews.com/conferences

EDI CON USA, Boston, MA, USA, September 11-13 http://www.ediconusa.com

EPE ECCE, Warsaw, Poland, September 11-14 http://www.epe2017.com

Husum Wind, Husum, Germany, September 12-15 http://www.husumwind.com/husumwind/en/index.php

eGaN Technology Takes a Quantum Leap in Both Performance and Cost
Efficient Power Conversion Corporation advances the performance capability while lowering the cost of off-the-shelf gallium nitride transistors with the introduction of the EPC2045 (7 m?, 100 V) and the EPC2047 (10 m?, 200 V) eGaN FETs. Applications for the EPC2045 include single stage 48 V to load Open Rack server architectures, point-of-load converters, USB-C, and LiDAR. Wireless charging, multi-level AC-DC power supplies, robotics, and solar micro inverters are examples
http://www.epc-co.com

Superjunction +FETs Push Performance Envelope
D3 Semiconductor, a company bringing together affiliated semiconductor companies and top-talent experts, announces its inaugural entry into the power semiconductor market with the launch of its +FET line of 650V-rated superjunction MOSFETs. +FET MOSFETs enable high-efficiency solutions for a range of hard-switched applications, including PFC boost and inverters used in telecom, enterprise computing, UPS and solar.
http://www.d3semi.com/MOSFET-Overview

Digitally Controlled Surge Voltage, Inrush, and Short-Circuit Protection
IXYS Corporation announced a digital power design that demonstrates surge voltage protection as well as inrush current and short-circuit protection for battery powered devices based on the Zilog MCU. This reference design demonstrates the cost effective use of proven Zilog MCU for digital power control, integrating IXYS power and digital control software in one ready to use design.
http://www.ixys.com

Best-in-Class 900V MOSFETs Enhance Power and Efficiency of Flyback Converters
Power-supply designers can satisfy system demands for higher power and greater efficiency using the latest 900V MDmesh K5 super-junction MOSFETs from STMicroelectronics, which deliver best-in-class on-resistance (RDS(ON)) and dynamic characteristics. A 900V breakdown voltage assures extra safety margin in systems with high bus voltages. The series contains the first 900V MOSFETs with RDS(ON) below 100m?, and gives the industry's best RDS(ON) among DPAK devices.
http://www.st.com/mdmeshk5

AEC-Q100 Qualified Family of 40V PoL Regulators
Exar Corporation announced a AEC-Q100 qualified family of 40V switching regulators for automotive applications such as infotainment head units and Advanced Driver Assistance Systems (ADAS). The XR76203-Q, XR76205-Q and XR76208-Q are 3A/5A/8A synchronous step-down regulators designed to provide a wide 5.5V to 40V input voltage range and an adjustable output voltage down to 0.6V while providing excellent transient response and output accuracy over the entire voltage range.
http://www.exar.com/xr76205-q

Low-Cost Regulated SIP8 DC/DC Converters
Recom's regulated DC/DC converters RSE (2 Watt) and RSOE (1 Watt) series were developed for a variety of industrial, transport, test & measurement which require on-board 5V power supplies; the cost-effective converters operate at extreme temperatures from -40°C up to +80°C at full load.
The fully upgraded DC/DC converters are offered with nominal 2:1 input voltages of 5V and 24V and with 5V output voltage.
http://www.recom-power.com

Supercapacitor Technology Delivers Ultra-High Pulse Power and Capacitance Densities
Double Layer Capacitors provide a unique combination of characteristics recognized as delivering an excellent compromise between electronic and dielectric capacitors. Available now in Europe through TTI, Inc. the technologies developed by AVX in its BestCap, SCC Series Cylindrical and SCM Series.
http://www.ttieurope.com

Light Pipes for Status Display
SCHURTER improves upon a classic product: the new 6600-5 series IEC outlets are available with integrated light pipes. An intelligent, space and cost-saving solution for PDUs used in data centers and other multi-distributed power applications. The triggering of the LEDs is freely configurable, wherein each state can be clearly and independently represented.
http://www.schurter.com

Highly Integrated Multi-Cell Battery Pack Monitor
Intersil, a subsidiary of Renesas Electronics Corporation announced the ISL94202 3-to-8 cell battery pack monitor that supports Li-ion and other battery chemistries used in applications. Li-ion batteries are smaller, weigh less, and deliver longer battery life than other battery chemistries, but require monitoring and protection for safe use.
http://www.intersil.com/products/isl94202

Versatile, Stable, Low-Voiding Indium8.9HF Solder Paste at SMT Hybrid Packaging 2017
Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany. Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. See Indium Corporation at SMT booth 4-321.
http://www.Indium.com

New Reflow Generation at the SMT/Hybrid/Packaging
Under the motto "SMT - Innovation creates future", SMT Thermal Discoveries presents as an absolute highlight its newly developed reflow soldering system SMT QuattroPeak 3.6. In modern design with new options in the operating software, SMT points the way to the Smart SMT Factory from the standpoint of Industry 4.0 and impresses with the usual extremely low energy consumption.
SMT Hybrid Packaging, booth 4-149
http://www.smt-wertheim.de

Compact Calibrated 2000A Current Sensing Busbar Probe
The Raztec RAZP-2000 sensor is a compact, high current, open loop current sensor, capable of operating under high overload and ambient temperature conditions. It is specifically designed for use in applications where small size is critical and current is to be measured economically. It mounts through a 6.5 or 7.5mm diameter hole in the current carrying bus bar. The RAZP-2000 incorporates hybrid technology to assure excellent speed of response for the fast detection of fault current transients.
http://www.pewatron.com

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