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Dear Friends,
Summer has started in Europe. Soon we will meet in Nuremberg for PCIM Europe. In addition there will be also SMT during the same time frame. My readers can get the free season exhibition ticket. Just go to www.pcim-europe.com/tickets and enter the code 1812319441 for free entrance to the exhibition. Listen to the last results of wide band gap development on my podium at PCIM Europe on Wednesday, 6th of June at Hall 6 Booth 143 From 13:30 to 14:30 we have "SIC – Devices for the Future Design" From 14:30 to 15:30 we have "GaN – Devices for the Future Design" Mark up your calendar to see us in Nuremberg. See you in Nurnberg in June for PCIM Europe.
Best Regards,
Bodo Arlt editor@bodospower.com
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e-News Letter Content - just click and get to your topic: |
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The News |
CIE - Lighthouse in Electronics at the Danish/German Border
A unique public-private partnership was created last summer when Danfoss, Linak, the Bitten and Mads Clausen's Foundation, the Region of Southern Denmark, Sønderborg Municipality and SDU joined forces and established the Centre for Industrial Electronics (CIE) as part of the section SDU Electrical Engineering. Altogether, the six partners invest more than 30 million € in order to address the shortage of engineers which enterprises of the region are facing. A completely new building will be erected, connected to the existing university building with a glass bridge and accommodating laboratories and test facilities for the new centre.
http://www.sdu.dk/cie
Automotive Power Module Qualification Guideline AQG 324 Released by the European CPE Network
The ECPE Guideline AQG 324 ´Qualification of Power Modules for Use in Power Electronics Converter Units (PCUs) in Motor Vehicles´ has been released by the responsible ECPE Working Group ´Automotive Power Module Qualification´ comprising more than 30 ECPE member companies from the automotive market. This guideline is based on the supply specification LV 324 which has been developed a few years ago by German automotive OEMs together with representatives from the power electronics supplier industry in a joint working group of ECPE and the German ZVEI association.
http://www.ecpe.org
Compete for the 2018 "GAN Systems CUP"
In support of worldwide innovation in the power electronics industry, GaN Systems is once again sponsoring the distinguished China Power Supply Society (CPSS) design competition, which is currently underway with many top engineering teams participating from leading universities throughout China. The fourth annual "GaN Systems Cup," continues to promote and build excitement in the advancement of power electronic systems leveraging the benefits of GaN transistors.
http://www.gansystems.com
Presenting Press-Pack IGBT and IGBT Drivers at PCIM Europe 2018
Proton-Electrotex is making final preparations for the largest exhibition in the industry of power electronics, PCIM Europe 2018, taking place on June 5-7th in Nuremberg, Germany. This year our company is proud to announce two important additions to our portfolio that will be presented at the expo. • IGBT Driver DI28-17-E-1 is a dual channel IGBT plug&play driver designed specifically for 34 & 62 mm IGBT modules with voltage class up to 1.7 kV. • Press-pack IGBT Module (MCDA) is a full-SiC 1200V 500A low inductance half-bridge / phase-leg module in industry-standard housing. Its compact design ensures flexibility, small size and cost reduction on the system level. Meet us in Hall 9, Booth 115 on June 5-7th in Nuremberg Exhibition Center for more detailed information about these and many other brand new products to be launched in 2018. To plan a more detailed meeting please let us know by email: marketing@proton-electrotex.com.
http://www.proton-electrotex.com
Infineon Reported Results for the Second Quarter of the 2018 Fiscal Year
"Infineon continues to grow profitably," stated Dr. Reinhard Ploss, CEO of Infineon. "Our growth is broadly based: Solutions for the entire range of drivetrain systems for all types of electric vehicles, including 48-volt systems, high-speed trains and renewable power generation. In addition, we are seeing growing demand for data center power supplies for artificial intelligence. Our order books are bulging. We therefore are very confident that we will achieve our revenue targets for the 2018 fiscal year. Compared to the previous year's March quarter, the average US dollar exchange rate against the euro fell by around 16 percent in the three-month period to 31 March 2018. Despite headwinds from the US dollar and rising material prices, we expect to achieve our targeted Segment Result Margin of 17 percent again in the 2018 fiscal year. This demonstrates the robustness of our business model," continued Dr. Reinhard Ploss.
http://www.infineon.com
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Preview of Content in the June Issue |
Viewpoint
Showtime in Nuremberg!
Blue Product of the Month
Win a Microchip Curiosity HPC Development Board
Green Product of the Month
PowerForge: A Game-Changing Tool for Power Converter Design
Guest Editorial
Semiconductors Bring Robots Closer to Humans
Robots have long been the workhorses on the production lines in modern factories. Manufacturers worldwide benefit in terms of increased productivity and cost optimization. Against the background of Industry 4.0 and Smart Factory, the latest generation of industrial robots is revolutionizing traditional production processes. This generation is used as collaborative robots, otherwise known as cobots.
By Dr. Peter Wawer, Division President Industrial Power Control at Infineon
Guest Editorial
15 Years Anniversary of the European Center for Power Electronics ECPE
In 2018, ECPE European Center for Power Electronics is celebrating its 15 years anniversary. In 2003, the European Power Electronics Research Network was founded by the eight leading companies Infineon Technologies, SEMIKRON Elektronik, EPCOS, Siemens, STMicroelectronics, Conti Temic microelectronic, NMB-Minebea and SEW-Eurodrive.
By Thomas Harder, Managing Director ECPE GmbH
Guest Editorial
Indian IT Expert Got a Job in Nuremberg with the Blue Card
Sankara R. is a 33-year-old computer expert from India who recently came to live and work in Nuremberg. He is one of now more than 77,000 people who ever received a Blue Card in Germany.
By Martina Frimberger, Bundesamt für Migration und Flüchtlinge
VIP Interview
ROHM Focusses on SiC Plus on Automotive and Industrial Markets
Bodo´s Power Systems interviewed the management of ROHM Europe and ROHM Semiconductor GmbH in Willich about actual and future economic and technological plans and developments of the company especially in Europe.
By Roland R. Ackermann, Correspondent Editor Bodo’s Power Systems
Cover Story
Maximise Your Power: With New Chips and New Topologies to the Next Level of Power Density
Thanks to its easy assembly concept, MiniSKiiP knows no bounds when it comes to new applications and markets. The MiniSKiiP Dual Split MLI offers the most powerful baseplate-less string inverter design available and is ready for 1500V DC bus voltage and up to 180kW output power. In a second version optimised for 1000V DC bus, the same design pushes the power density of medium-power standalone and modular UPS designs to 150kW.
By Stefan Häuser, Bernhard Eichler, Thomas Hürtgen and Werner Obermaier, SEMIKRON Elektronik
Design and Simulation
GaN Systems Unveils an Online Circuit Simulation Tool for Evaluating Gallium Nitride Power Transistor Circuits
The Circuit Simulation Tool allows you to virtually test Gallium Nitride (GaN) transistor circuits before you even have hardware built by comparing application conditions. With a simple and intuitive interface, engineers can quickly and easily tune parameters to suit their design goals, explore merits of alternative designs, and see the results in real time.
By Kristofer Eberle, Plexim and Paul Wiener, GaN Systems
Design and Simulation
Designing Custom Inductors with ONE Design Equation
In the last article of this series, I introduced one equation that matters for inductor design. This is the equation that you will use when you are creating a custom design from scratch. Please note that we are talking about the design of an inductor, NOT the analysis process. Mathematical structure analysis can be quite involved and is a popular subject for PhD dissertations.
By Dr. Ray Ridley, Ridley Engineering Inc.
Power Modules
Hitachi Suijin Series of Power Modules for Electric Vehicles
Hitachi's Suijin series of automotive power modules provide a range of high power, high performance power modules to meet the most demanding automotive applications. Electric Vehicles are receiving ever-greater attention from vehicle manufacturers, governments, regulators and consumers and the pressure is increasing on vehicle designers to deliver on the technology's promise.
By Chris White, Hitachi Europe Limited
Renewable Energy
Making Single-Phase Solar Inverters Smaller, Cheaper & Safer
New technologies allow photo-voltaic (PV) inverters to switch at ever higher frequencies and consequently they are becoming much smaller and lighter. International competition and the move away from subsidies for new installations mean that there is strong pressure on their cost. The current transducers used in PV inverters must follow these trends: they must have a reduced footprint while having equivalent or improved performance at lower cost, compared to the transducers they replace.
By Hans Dieter Huber, LEM
Intelligent Power
New Transfer Molded SMD Type IPM
Mitsubishi Electric has added a new transfer molded SMD type Intelligent Power Module to its line-up - the MISOP. The MISOP is an ideal solution for high performance inverters in the range of 100W which require a high degree of compactness, high efficiency and easy assembly.
By Narender Lakshmanan and Muzaffer Albayrak from Mitsubishi Electric Europe B.V, Germany
Teruaki Nagahara, Mitsubishi Electric Power Device Works, Japan
Capacitors
Aluminum Sealed Film Capacitors for Harsh Humid Environments
FTCAP has developed new aluminum sealed film capacitors that are perfectly suited for the use in offshore wind-energy conversion systems. The capacitors are equipped with a special encapsulation and an aluminum deck, and perform with a longer life under harsh humid conditions. Long-term tests confirm with use of the innovative capacitors sealing show a ten times less water adsorption rate than with a conventional sealing.
By Dr. Thomas Ebel, Managing Director, FTCAP GmbH
IGBTs
Making the Most of Three-Level NPC Topology
Three-level NPC topologies are popular choices for solar, UPS and energy storage applications these days. The unique requirements of each application play a key role when selecting the components for a power module. A universal standard chipset is not always the best solution. This article looks at two chipset combinations to highlight the importance of understanding how the target parameters affect the selection of chips and modules.
By Guillem Gargallo Pallardó, Product Marketing Manager, Vincotech GmbH
Design and Simulation
Handling Late Changes in Power System Designs
Providing power to today's electronic systems designs has become a complex and challenging exercise. Stable power, efficiently delivered at the correct levels, is the bedrock on which all other performance parameters rest. The pursuit of ever-more demanding specifications and ever-lower power losses has come to be seen as requiring more specialised expertise. Those working in the power area see some serious problems ahead, and anticipate a need for more engineering resources, for better-qualified and more-experienced power system engineers – and for new approaches to architecting, and implementing the power system design.
By Lev Slutskiy, Business Development Manager, Central/Eastern Europe, Vicor
Technology
DCM 1000X - Designed to Meet the Future SiC Demand of Electric Vehicle Drive Trains
Global warming and pollution as well as international carbon emission targets initiated a process to reduce car emissions. The automotive industry pushes to improve fuel efficiency and reduce emissions, also by increasing the vehicle electrification. Increasing global demand for BHEV, BEV vehicles and new drive train designs causes automotive manufacturers to evaluate suitable power electronic technology in their current and future designs. Automotive manufacturers constantly seek improved overall performance: higher conversion efficiency, reduced cost, lower weight, higher power density.
By Omid Shajarati, Alexander Streibel and Norbert Apfel, Danfoss Silicon Power
Thermal Management
Temperature and Overload Protected Triac – TOPTriac
Over decades Triacs have been used as power switches. The emergence of smart appliances and greater emphasis on safety has suggested the need for Triacs with self-protection features and smart monitoring capabilityy. TOPTriacTM meets this need. Triacs are the most widely used solid state AC power switches for controlling AC mains loads of 50/60Hz or even 400Hz. They are widely used in home appliances, commercial and industrial equipment.
By Nick Ham, Matjaz Rozman, Ed Huang and Stephen Wood, WeEn Semiconductors
Transistors
Benefiting from the Evolution in Power Transistors
Evolution is an important part of any company enabled by technology. As a company with over 85 years' experience in drive technology, with 77 drive technology centers in 50 countries around the world and sales of over €3 billion in 2017/18, SEW-Eurodrive is recognized for its expertise in supplying key industries including Automotive, Airport Baggage Handling, Transport & Logistics, and Beverages & Liquids. As such, it understands how adopting the latest technological innovations is fundamental to remaining a leader in its field.
By Christopher Rocneanu, Business Development Manager, UnitedSiC
Driver ICs
Optimisation of dV/dt – Losses Trade Off Using Switchable Gate Resistance
System-level effects in power converters are often caused or constrained by behaviour of the power semiconductor devices, for example high dV/dt from modern IGBTs. Bulky and lossy dV/dt filters are often required in high-power converters to limit the voltage stress on insulation of wound components, e.g. motors. By taking advantage of real-time bi-directional communication over the fibre-optic link, Amantys gate drives reduce the need for dV/dt filtering through intelligent selection of gate resistance, thus enhancing the overall system performance and power density.
By Dr Angus Bryant, Amantys Power Electronics Limited
Driver ICs
Dynamically Configurable Off-Line Switcher IC for Higher Application Flexibility
InnoSwitch3-Pro integrated switcher ICs enable digital micro-stepping of voltage and current for precise battery charge control and elimination of DC-DC post-regulators, and provide 65 W power output at efficiency levels of up to 94% across line and load conditions.
By Jason Yan, Senior Technology Training Manager at Power Integrations
Transistors
A Novel Circuit Topology for Turning a 'Normally On' GaN Transistor into 'Normally Off' that Can be Driven by Popular Drivers
In the past year, it has become clear that Gallium Nitride (GaN) power transistors have been successfully launched in end user's products, as has been reported by the various GaN device manufacturers. Examples include Transphorm products in Corsair's AX1600i Power Supply Unit (PSU) and Bel Power Solution's TET3000-12-069RA power supply, and Infineon products in Eltek's Flatpack2 SHE power conversion module. The system performance and cost benefits in, for instance, a Totem Pole Power Factor Correction (PFC) in high-end AC/DC power supplies (such as is the case in the Corsair and Bel Power Solutions' products) are so significant that GaN transistors are clearly destined to replace the incumbent Si MOSFET transistors.
By Prof. Shmuel (Sam) Ben-Yaakov, Ben-Gurion University, and Luc Van de Perre, Sr. Director of Sales and Marketing, VisIC Technologies
Thermal Management
New Advances in Friction Stir Welding for Cold Plate Manufacture
The electronics world is ever evolving, and today the trend towards wearable products, VR and the connected world decreases the size of many products. Reliability is directly linked to cost and design engineers are under increasing pressure to reduce component volume, mass and cost.
By John Broadbent, Managing Director, Columbia-Staver
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Events |
ISPSD Conference, Chicago, USA, May 13-17
http://www.ispsd.org
Energy Storage Forum, Berlin, Germany, May 14-18
http://www.energystorageforum.com
EV Tech Expo Europe, Hannover, Germany, May 15-17
http://www.evtechexpo.eu
IPEC ECCE Asia, Niigata, Japan, May 20-24
http://www.ipec2018.org
EnerHarv, Cork, Ireland, May 29-31
http://enerharv.com
PCIM Europe, Nuremberg, Germany, June 5-7
http://www.mesago.de/en/PCIM/home.htm
SMT Hybrid, Nuremberg, Germany, June 5-7
http://www.mesago.de/en/SMT/home.htm
SCAPE, Stockholm, Sweden, June 11-12
http://www.acreo.se/projects/sic-power-center
CWIEME Berlin, Berlin, Germany, June 19-21
http://www.coilwindingexpo.com/berlin/BPN
Speedam, Amalfi Coast, Italy, June 20-22
http://www.speedam.org
Intersolar Europe, Munich, Germany, June 20-22
http://www.intersolar.de/en/home.html
3D Power Electronics Integration and Manufacturing, Maryland, USA, June 25-27
http://www.3d-peim.org
PCIM Asia, Shanghai, China, June 26-28
http://www.pcimasia-expo.com
Sensor+Test, Nuremberg, Germany, June 26-28
http://www.sensor-test.de
Fortronic Power, Modena, Italy, June 27-28
https://fortronic.it/english
Conference on Engineering Failure Analysis, Budapest, Hungary, July 8-11
http://www.icefaconference.com
SEMICON West, San Francisco, CA, USA, July 10-12
http://www.semiconwest.org
Thermal Management, Denver, Colorado, USA, August 8-9
http://www.thermalconference.com
IEEE-PEMC, Budapest, Hungary, August 26-30
http://www.ieee-pemc2018.org
Semicon Taiwan, Taipei, Taiwan, September 5-8
http://www.semicontaiwan.org/en
EV Tech Expo, Novi, MI, USA, September 11-13
http://www.evtechexpo.com
EPE ECCE, Riga, Latvia, September 17-21
http://www.epe2018.com
SPS Middle East, Dubai, UAE, September 18-19
http://www.spsautomationme.com
Innotrans, Berlin, Germany, September 18-21
http://www.innotrans.com
ECCE, Portland, Oregon, USA, September 23-27
http://www.ieee-ecce.org
EU PVSEC, Brussels, Belgium, September 24-28
http://www.photovoltaic-conference.com
LED Professional, Bregenz, Austria, September 25-27
http://www.led-professional-symposium.com
WindEnergy Hamburg, Hamburg, Germany, September 25-28
http://www.windenergyhamburg.com
ESREF, Aalborg, Denmark, October 1-5
http://www.esref.org
CWIEME Chicago, Chicago, IL, USA, October 2-4
http://www.coilwindingexpo.com/chicago
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New Products |
5.5-V DC/DC Step-Down Power Module
Texas Instruments introduced a 5.5-V step-down power module that delivers true, continuous 6-A output current with up to 95 percent efficiency. The easy-to-use TPSM82480 DC/DC module integrates power metal-oxide semiconductor field-effect transistors (MOSFETs) and shielded inductors into a tiny, low-profile footprint for space- and height-constrained applications such as point-of-load telecommunications, networking, and test and measurement power supplies. For more information, samples and an evaluation module, see www.ti.com/tpsm82480-pr.
http://www.ti.com
I2C Controllable EZBuck Regulator
Alpha and Omega Semiconductor Limited introduced and new family of EZBuck regulators featuring I2C control. The first two members of the family are the 4A AOZ2231CQI-01 and the 8A AOZ2233CQI-02. The new devices provide a compact, efficient power converter solution for next-generation chipsets and FPGAs used in high-end TVs, set-top boxes, data storage systems, servers and other embedded systems. Next generation microprocessors and SoCs often use dynamic voltage scaling to reduce power dissipation and improve system performance. Implementing dynamic voltage scaling in a DC/DC converter often requires several external components.
http://www.aosmd.com
The Smallest of its Kind in Composite Technology
With the BVF, Isabellenhütte Heusler GmbH and Co. KG has developed a precision resistor that not only impresses with its unique overall size 1213 (3.1 mm x 3.3 mm), but also with its extremely high load capacity and precision in use. Smaller electrically-operated applications in particular benefit from the properties of the high-performance component that Isabellenhütte has now included in its series repertoire. With its small overall size, the BVF is currently unique on the market. The temperature coefficient of the BVF precision resistor is just under 70 ppm/K. The thermal resistance is also extremely low at 10 K/W. This results in the high load capacity of the BVF of 3 watts at up to a temperature of 145°C at the contact point.
http://www.isabellenhuette.com
IoT Growth Drives Demand for Highly Integrated Power over Ethernet ICs
Silicon Labs has released two new Power over Ethernet (PoE) Powered Device (PD) families delivering best-in-class integration and efficiency for a wide range of Internet of Things (IoT) applications. Silicon Labs' Si3406x and Si3404 families include all necessary high-voltage discrete components on a single PD chip. The new PD ICs support IEEE 802.3 at PoE+ power capabilities, flexible power conversion options exceeding 90 percent efficiency, robust sleep/wake/LED support modes and superior EMI immunity. These capabilities help developers reduce system cost and time to market for high-power, high-efficiency PoE PD applications.
http://www.silabs.com
6W and 10W SMD/DIP DC/DC Converters
MORNSUN continued to enrich and expand existing packages (DIP24, 1*1 and 2*1) of DC/DC Converters and developed new ultra-thin 6W and 10W DC/DC Converters, to meet customers' differential needs for packages in practical applications. The dimension of 6W converter is 31.60*18.10*6.10mm (about 1.24*0.71*0.24 inch) and 10W is 39.20*20.80*6.10mm (about 1.54*0.82*0.24 inch). Packages are available in SMD, DIP, open frame and metal case. When it comes to performance, the new SMD 6W and 10W DC/DC Converters feature R3 DC/DC Converters' advantages, providing isolation of 500VAC, efficiency up to 88%, no-load power consumption as low as 0.096W, multiple protections including SCP, OCP, OVP and input UVP. Features: a) Ultra-thin DC/DC Converters in DIP/SMD package b) Ultra-wide input voltage range: 4:1, 2:1 c) Efficiency high up to 88% d) No-load power consumption as low as 0.096W e) Isolation voltage: 500VAC f) Operating temperature range: -40? to +85? g) Protections: SCP, OCP, OVP and input UVP
http://www.mornsun-power.com
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Content provider in terms of the german Telemediengesetz (TMG): Bodo's Power Systems Responsible according to § 6 TMG: Bodo Arlt -
editor@bodospower.com
Address: Katzbek 17a - D-24235 Laboe Germany Phone: +49 4343 421790 Fax: +49 4343 421789
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