Dear Friends,

Many advances are being made in materials science. Making the right choice for your application is not always easy, here is some help.

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Thermal Solution for Power Devices of Automotive

As you know, thermal management is considered important for reliability of the device, and heatspreaders (or spacer) are used as one of the cooling solutions. Especially for devices of automotive, heatspreaders are desired to have high thermal conductivity and to match the coefficient of thermal expansion with semiconductor materials to realize high reliability for the devices.

For that area, A.L.M.T. Corp. proposes some thermal solution items.

Ag-Diamond (Silver-Diamond) - For those who place more importance on higher performance.

• High thermal conductivity, 600 W/ (m･K).
• The coefficient of thermal expansion is close to semiconductor chips and ceramic materials.

CPC (Cu/CuMo/Cu) - For those who place more importance on lower cost.

• High thermal conductivity.
• A laminated material made with copper-molybdenum (Cu-Mo) sandwiched between copper layers.
• The coefficient of thermal expansion is adjustable to match with surrounding materials.
• High mass-production capability by using rolling and stamping processes.
• Used often for amplifiers in cell phone base stations.
• Used as a spacer for power devices of automobiles.

Moreover, we have the other heatspreaders for your power devices.

Cu-Mo (Copper-Molybdenum)

• Adjustable the coefficient of thermal expansion.
• A composite material made of Copper, very high thermal conductivity, and Molybdenum, a metal with very low thermal expansion.
• High mass-production capability by using rolling and stamping processes.

Mg-SiC (Magnesium-Silicon Carbide)

• Lightweight.
• Strong structural stability helps preserve quality contact with thermal sources over long periods.
• Higher thermal conductivity than Al-SiC.
• A low coefficient of thermal expansion, close to Al-SiC.

Need any detailed information? Click the banner below for technical data!

A.L.M.T. Corp.

Inquiry-hs@allied-material.co.jp