Dear Friends,

Surface Mount Power Device packages allow design optimization opportunities across a number of power electronics applications, including drives, inverters and DC/DC converters.

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With the Surface Mount Power Device (SMPD)- package, Litttelfuse has enlarged the ISOPLUS family. This portfolio of power semiconductor components allows a modular approach to set up a wide variety of power electronic applications.

Spreading the heat to larger areas enhances the thermal performance while at the same time releasing the designer from unwanted proximities, often seen in CBI-style power modules.

The isolated architecture and the combination of DCB and lead frame are key to building most compact designs in challenging applications like industrial drives or off-board EV-chargers.

The package can easily be mounted in a variety of ways, giving the designer further degrees of freedom in setting up their layouts.

The SMPD package provides unique features for power electronic applications.

These include:

• High electric insulation strength of 2500 V
• Lower thermal resistance compared to standard packages like TO-247 or TO-264
• Enhanced flexibility regarding customized topologies
• Higher current carrying capability compared to TO-style packages
• Internal construction is designed to reduce parasitic effects like stray inductance and parasitic capacitances, leading to improved EMI-performance

All these advantages make the SMPD package an exceptional candidate for both Si and SiC power semiconductors.

Download our Application Note for various mounting solutions for SMPD packages.