Dear Friends,

Today’s partner is known for a wide portfolio of power semiconductors, including wide bandgap technology. This will provide you the best solution for your design.

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Bodo Arlt

Multi-chip, modular devices in discrete-sized packages that can be used as power stage building blocks

Ideal for EV charging infrastructure, medical, and industrial applications, our ISOPLUS-SMPD™ and ISOPLUS™ i4-PAC™ package solutions bridge the gap between modules and discretes, providing a range of advantages and value additions:

• Integrated Direct Copper Bonded (DCB) isolation delivers best-in-class reliability under power and temperature cycling via the IXYS proprietary DCB production and discrete assembly with 2.5 kV minimum isolation voltage
   
• Available in a variety of technologies, such as Si/SiC MOSFET, IGBT, Diode, Thyristor, TRIAC, or a customized combination with different voltage classes: SMPD™ (40 V to 3000 V) and i4-PAC (100 V to 4500 V)
   
• Offered in several topologies, including single switch, phase leg, H-Bridge, and others
   
• The SMPD allows fully automated pick and place as well as standard reflow soldering for ease of manufacturing
   
• Optimized use of DCB space in the component improves the power density and thermal management
   

To learn more about how these compact packages leverage various technologies and topologies, download our product brief.