Dear Friends,

This whitepaper gives you an informative update on the latest GaN-approaches. Wide bandgap technology will increase your design’s reliability and efficiency.

Find all my magazines from 2006 on in our free archive on bodospower.com. There is no better way to communicate. We all share one world. As a publisher I serve the world: one magazine, on time, every time.

Kind regards,
Bodo Arlt

Headline: Whitepaper: Modeling and simulation of GaN power systems

Discover how Infineon's GaN device models are revolutionizing power electronics. Download our latest whitepaper to explore the comprehensive examination of our GaN device models across multiple SPICE simulation platforms.

Learn in depth about:

• Comprehensive modeling hierarchy (L0-L3) for accurate simulations
• Electro-thermal behavior and thermal modeling capabilities
• Implementation of source-sense terminals and parasitic
• Validation of simulated results against real-world test benches for reliable switching loss characterization and thermal optimization

By leveraging Infineon's GaN device models, engineers can reduce design iterations, anticipate thermal stress, and model system-level behavior with greater confidence. Download the whitepaper now to unlock the full potential of GaN technology and take your power electronics designs to the next level.