Dear Friends,

These solutions cover all stages of module assembly (die-attach, package-attach, top-side interconnect, substrate attach, etc.), targeting high-stress markets like automotive, computing, and energy infrastructure. Visit their booth at Productronica Munich later this month!

Find all my magazines from 2006 on in our free archive on bodospower.com. There is no better way to communicate. We all share one world. As a publisher I serve the world: one magazine, on time, every time.

Kind regards,
Bodo Arlt

High-Reliability Materials Solutions for All Power Electronics Devices

Indium Corporation^® specializes in power device packaging, offering a full portfolio of advanced materials solutions encompassing the entire assembly.

These materials are: Enabling electrification with robust performance Offering high reliability for extended life Providing options engineered to meet the mission profile

Visit Indium Corporation at Productronica, A4.309, to learn more about the materials driving reliability in power electronics devices, including:

Die-Attach Solutions:

• InFORCE^® 29 Pressure Copper Sinter Paste
• InBAKE™ 29 Pressureless Copper Sinter Paste
• Durafuse^® HT Pb-Free High Melting Temperature Solder
• InFORCE^® MF Pressure Silver Sinter Paste
• InFORMS^® Reinforced Solder Preforms
• AuLTRA^® Precision Die-Attach Preforms

Package-Attach Solutions:

• InFORMS^® Reinforced Solder Preforms and Innovative Alloy Solutions
• InFORCE^®Ag or Cu Pressure Sinter Pastes

Formic Acid Soldering Technology (FAST), which provides high-reliability, flux-free soldering solutions for next-generation power electronics:

• FAST Solder Paste
• InFORMS^® Reinforced Solder Preforms
• InTACK^® Robust, No-Residue Tacking Agent
• Specialized Solder Preforms