Dear Friends,

As power density increases, integrating more functionality into the power stage becomes less of a convenience and more of a necessity. Combining switching devices, gate drive and protection into a single module can significantly reduce design effort while improving switching performance and robustness.

Find all my magazines from 2006 on in our free archive on bodospower.com. There is no better way to communicate. We all share one world. As a publisher I serve the world: one magazine, on time, every time.

Kind regards,
Bodo Arlt

Apex Microtechnology Introduces new Silicon Carbide Integrated Power Module: MSA303

Apex Microtechnology recently released the MSA303, the latest member to its family of Integrated Power Modules. The module utilizes Silicon Carbide MOSFET technology to improve efficiency and deliver 40A of continuous current with 600V voltage supply. The MSA303 is built on a thermally conductive, but electrically isolated substrate to provide versatility and ease in heatsinking.

By integrating three half-bridges, gate drive circuitry, and protection features into a single module, the MSA303 supports system designs where size, weight, and power (SWaP) are critical considerations. Its compact architecture enables high power delivery within a small footprint, helping engineers optimize space in demanding application environments.

Features

• Three fully independent half-bridges within a compact footprint
• Best-in-class switching performance due to integrated gate driver
• Under-voltage lock-out and Active Miller clamping
• Internal bootstrap operation

Applications

• Motor drive & control
• Variable frequency drives
• DC/AC converters
• Power inverters
• Test equipment

Compact Design and Package

• 30.5mm x 41.9mm body size
• 22-pin package with vertical mounting pins
• Electrically isolated substrate

For more information about MSA303, visit: apexanalog.com