Dear Friends,

Here comes the preview of my February issue. A big thank you goes to Qorvo for providing the cover story. It's our first time working together since their integration of United SiC, and everything has worked out great. Business is both: Maintaining existing relationships and meeting new people. And I couldn't think of another industry where that would be as easy as in ours!

Mark your calendar for my next virtual Wide Bandgap Expert Talk on January 25, 3:00 to 4:00 PM CET.
I have invited engineers from ROHM, Navitas and VisIC and look forward to an interesting conversation. Take the chance to get your questions answered first-hand by real Wide Bandgap experts!

Find all my magazines from 2006 on in the free archive on my website.
Do not miss our Chinese version bodospowerchina.com.
There is no better way to communicate. We all share one world.
As a publisher I serve the world: one magazine, on time, every time.

Best Regards,

Bodo Arlt editor@bodospower.com

Silicon Carbide Devices Power Future Electric Vehicle Platforms
Wolfspeed announced the company will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms, enabling greater efficiency in the powertrain.  
Read more ...

Supporting the Transmission of Renewable Power
Hitachi Energy announced that it has been selected by Hydro-Québec for its high-voltage direct current (HVDC) technology for the transmission of electricity, which will ensure the sustainability of the energy exchange between the Quebec network, in eastern Canada, and New York State in the northeastern United States.
Read more ...

Part of Energy Industries Division to be Acquired
TÜV Rheinland signs an agreement to acquire ABB's UK technical engineering consultancy, part of ABB's Energy Industries division.
Read more ...

Formula E Team Kicks Off Season 9 in Mexico City
Mouser Electronics cheers on the DS PENSKE Formula E team as they kick off Season 9 at the Autodromo Hermanos Rodriguez track in Mexico City on January 14, 2023.
Read more ...

Partnership to Develop Emerging Technologies
J.A.M.E.S (Jetted Additively Manufactured Electronics Sources) announced a partnership with heliguyTM Lab. The goal of this partnership is to join a global network to foster Additively Manufactured Electronics (AME) technology and redefine the electronics industry.
Read more ...

SiC Technology Enhances Performance of DC Optimizers
onsemi and Ampt LLC announced their collaboration to meet the high demand for DC string optimizers. Ampt uses onsemi's N-Channel SiC MOSFET, part of the EliteSiC family of silicon carbide (SiC) technologies.
Read more ...

Sales Achievements Recognised
Distrelec announced the company has received the Award for Best Sales and Accounts Growth from Keysight Technologies, as part of its 2022 Partner Executive Forum which took place in Athens (Greece).
Read more ...

Dr. Richard McDonough Assumes Role as Material Research Scientist
Indium Corporation is pleased to announce that Dr. Richard McDonough has been named Material Research Scientist. In his new role, Dr. McDonough is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications.
Read more ...

Award Reflects Support and Collaboration Spanning Over a Decade
TT Electronics has earned a Supplier Excellence Award from Applied Materials, which recognizes the company's top performing suppliers for outstanding technical and operational achievements in areas including quality, service, lead time, delivery, cost, and responsiveness.
Read more ...

SiC MOSFETs to be Used in Inverters for Electric Vehicles
ROHM has recently announced the adoption of its 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, a Japanese automotive parts manufacturer.
Read more ...

Viewpoint
The Power of Many

Cover Story
Programmable Power Management in the World of Vision Systems

Capturing images has become an integral part of many everyday and not-so-common applications from vehicle cameras through manufacturing inspection, to drones adding AI for machine learning and facial and gesture recognition. According to analysts 'MarketsandMarkets', the demand for video processing electronics is estimated to expand at a CAGR of 18.7% to around $3.2B by 2024 [1], with security and surveillance expected to have the highest growth rates.
By Qorvo

Power Modules
Parallel Operation: Influence of Power Module Parameters

The challenge of scalability approach by IGBT module paralleling is to understand the necessary de-rating of power converters under consideration of different module parameters. This understanding is important for proper module parallel operation inside the thermal and safe operation limits. This article describes the methodology of how to analyze the influence of module parameters on current sharing and switching energy imbalance for parallel operation of power modules.
By N. Soltau, E. Wiesner, Mitsubishi Electric Europe B.V., Ratingen, Germany; Y. Ando, J. Sakai, K. Hatori, Mitsubishi Electric Corporation, Fukuoka, Japan

DC/DC Converter
Immersed and Integrated Converter (30 kW) for Fuel Cell System in Aircraft Application

Integrated systems typically use several independent subsystems from different manufacturers connected to each other. To improve power density, some subsystems can be advantageously designed together. In the case of a hybrid system combining a fuel cell and a battery, the DC/DC converter dedicated to adjusting the voltages of the power sources can be coupled within the stack and share the cooling circuit.
By Sylvain Mercier, Bruno Beranger, Jacques Ecrabey, and Frédéric Gaillard, CEA

Thermal Management
Managing Thermals: 3 Ways to Break Through Power-Density Barriers

The number of semiconductors in nearly every application is multiplying, and many of the design challenges facing electronics engineers all tie back to the need for greater power density.
By Robert Taylor, Applications Engineer, Texas Instruments

Wide Bandgap
Switching Power Supplies with More than 96% Efficiency Due to the Use of GaN Transistors

The field of power electronics has evolved rapidly in recent decades. This is primarily due to the increasingly fast-switching semiconductor switches, which make it possible to design ever smaller components for storing electric energy, such as capacitors and inductances. Combined with an increased efficiency, this allows the realization of smaller power-electronic components such as power supply units and DC-DC converters.
By Sebastian Fischer, Dipl.-Ing., Managing Director Traco Power Germany; Erich Hinterleitner, Development Engineer Traco Power

Power Management
The Golden Rule of Board Layout for Switch-Mode Power Supplies

This article explains the basis for achieving an optimized board layout, a critical aspect in the design of switch-mode power supplies. A good layout ensures stable functioning of the switching regulator and minimizes radiated interference as well as conducted interference (EMI). This is widely known by electronics developers. However, what is not generally known is how an optimized board layout for a switch-mode power supply should look.
By Frederik Dostal, Power Management Expert, Analog Devices

IPC APEX, San Diego, CA, USA, January 21-26 ipcapexexpo.org

NEPCON, Tokyo, Japan, January 25-27 nepconjapan.jp

DesignCon, Santa Clara, CA, USA, January 31 - February 2 designcon.com

3D PEIM, Miami, FL, USA, February 1-3 3d-peim.org

Thermal Management for EV/HEV, Munich, Germany, February 21-23 automotive-iq.com

Satellite, Washington, DC, USA, March 13-16 satshow.com

SEMI-Therm, San Jose, CA, USA, March 13-17 semi-therm.org

embedded world, Nuremberg, Germany, March 14-16 embedded-world.de

APEC, Orlando, FL, USA, March 19-23 apec-conf.org

AMPER, Brno, CZ, March 21-23 amper.cz

productronica China, Shanghai, China, March 22-24 productronica-china.com

SEMICON China, Shanghai, China, March 22-24 semiconchina.org

Smart Systems Integration, Bruges, Belgium, March 28-30 smartsystemsintegration.com

emv, Stuttgart, Germany, March 28-30 emv.mesago.com

ESARS-ITEC, Venice, Italy, March 28-31 esars-itec.org

ExpoElectronica, Moscow, Russia, April 11-13 expoelectronica.ru

electronica China, Shanghai, China, April 13-15 electronica-china.com

PAEMEET, Valencia, Spain, April 17-19 albedomeetings.com

Hannover Messe, Hannover, Germany, April 17-21 hannovermesse.de

PE International, Brussels, Belgium, April 18-19 pe-international.net

Advanced Packaging for Power Electronics, Albuquerque, NM, USA, April 18-20 imaps.org

Fortronic Power, Bologna, Italy, April 19-20 fortronic.it

Battery Tech Expo, Silverstone, UK, April 20 batterytechexpo.co.uk

Thermal Management Expo, Novi, MI, USA, May 1-3 thermalmanagementexpo.com

PCIM Europe, Nuremberg, Germany, May 9-11 mesago.de/en/PCIM

Sensor+Test, Nuremberg, Germany, May 9-11 sensor-test.de

SMTconnect, Nuremberg, Germany, May 9-11 smt.mesago.com

BEV Thermal Management Innovation, Palo Alto, CA, USA, May 11 battery-thermal-management-usa.com

Power Semiconductor Module Will Help to Simplify and Downsize Inverter Systems
Mitsubishi Electric Corporation announced that its SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.
Read more ...

Space Level SMD Inductor
Ideal for space and aerospace applications, the S0603 inductor offers excellent temperature stability, High Q and Ultra High SRF values, Low Outgassing Properties and an Operating Temperature Range of -55 to +125 C degrees (higher operating temperatures available) - all in a super small rugged package.
Read more ...

Battery Cell and Pack Monitors
Texas Instruments introduced automotive battery cell and pack monitors, maximizing electric vehicle (EV) drive time and enabling safer operation. As EVs grow in popularity, advanced battery management systems (BMS) are helping overcome critical barriers to widespread adoption.
Read more ...

Full Brick Power Factor Correction AC-DC Module
TDK Corporation announces the introduction of the TDK-Lambda brand PF1500B-360 full brick power module. Rated at 1512W with an input of 170 to 265V or 1008W from 85 to 265V, the module delivers a non-isolated, regulated 360Vdc output with a 0.98 power factor.
Read more ...

Three-Level Configurable Slew-Rate Controlled Power Switch
Diodes has introduced a versatile single-channel high-side power switch. The DIODES AP22980 features three different selectable slew rates, so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability.
Read more ...

Medical and Industrial Power Conversion Platforms
Advanced Energy Industries introduced two ranges of AC-DC power supplies for critical medical and industrial equipment. The SL Power NGB800 800 W and NGB1200 1200 W families are optimized to address the performance, power, size, reliability and compliance requirements of medical and industrial applications.
Read more ...

Hybrid Supercapacitors Available with Capacitances of 10 F, 25 F and 150 F
EATON offers energy storage devices with particularly high capacity for reliable use in emergency power supply, pulse power and hybrid energy systems with the HS / HSL hybrid supercapacitors, available at Rutronik24.
Read more ...

Automotive-Grade Devices Run Cooler in Surface-Mount SMIT Package
STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST's ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.
Read more ...

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