Dear Friends! I am just back from Nuremberg and PCIM Europe was again a fantastic event. A more than decent number of visitors explored the 3 halls and what the 500+ exhibitors brought to Nuremberg. Sometimes I wonder if 3 days is really enough to see everything.

I would like to thank all the speakers on my panel on Wednesday. In fact, it almost looked like slightly more people came for GaN than SiC. If that is the case, that would be a first!
If there is anything to criticise about the event, it is the small number of seats on stage. Wide Bandgap is too important a technology, we must not miss any expertise. This is one reason why I originally started my Wide Bandgap Event in December. I will be back in Munich this year, stay tuned for more information!

Find all magazines from 2006 on in the free archive on my website.
Do not miss our Chinese version bodospowerchina.com.
There is no better way to communicate. We all share one world.
As a publisher I serve the world: one magazine, on time, every time. Best Regards, Bodo Arlt
Please add our address newsletter@bodospower.de to your approved sender list to ensure inbox delivery. View online version
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Dear Friends,

I am just back from Nuremberg and PCIM Europe was again a fantastic event. A more than decent number of visitors explored the 3 halls and what the 500+ exhibitors brought to Nuremberg. Sometimes I wonder if 3 days is really enough to see everything.

I would like to thank all the speakers on my panel on Wednesday. In fact, it almost looked like slightly more people came for GaN than SiC. If that is the case, that would be a first!
If there is anything to criticise about the event, it is the small number of seats on stage. Wide Bandgap is too important a technology, we must not miss any expertise. This is one reason why I originally started my Wide Bandgap Event in December. I will be back in Munich this year, stay tuned for more information!

Find all magazines from 2006 on in the free archive on my website.
Do not miss our Chinese version bodospowerchina.com.
There is no better way to communicate. We all share one world.
As a publisher I serve the world: one magazine, on time, every time.

Best Regards,

Bodo Arlt editor@bodospower.com

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e-Newsletter Content - just click and get to your topic:
The News
- Groundbreaking for Plant in Dresden
- The 2023 Symposium on VLSI Technology & Circuits
- Agreement Covers Complete Portfolio of Wide Band-Gap Semiconductors
- Investment in Semiconductor Business for Electromobility
- Digitally Integrated Ecosystem for EV Charging Solutions
- 10th Anniversary of Presence in Bulgaria
- EV Test Specialist Relies on Power Analyzer to Provide In Depth Analysis
- Awarded Top EMEA Distributor for Second Successive Year
- EMC 'Book of Knowledge'
Preview of Content in the June Issue
- Viewpoint
- Cover Story
- Wide Bandgap
- Design and Simulation
- Passive Components
- Design and Simulation
- Power Management
- Capacitors
- Wide Bandgap
- Battery
Events
New Products
- HVIGBT Module for Inverter Systems
- FETs Pin-to-Pin Compatible With e-mode Devices
- Wireless Power Transmitter IC for Charging Applications up to 50 W
- Reference Design Uses Controller Optimized to Drive GaN FETs
- DC Energy Meter Provides kWh-Based Charging Experience
- SMD Resettable PPTCs Series Created for High-Voltage Applications
- 600V Super Junction MOSFETs Family
- Metal Plate Shunt Resistor for Double-Sided Cooled Power Modules
- Dielectric Resonators and Ferrites Capabilities for Microwave Applications
- Battery-Protection IC Limits External Components
- 600 V Gallium Nitride (GaN) Hybrid-Drain-Embedded Gate Injection Transistor (HD-GIT)

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The News

Groundbreaking for Plant in Dresden
Infineon Technologies has broken ground for a plant in Dresden together with political leaders from Brussels, Berlin and Saxony. With an investment volume of five billion euros, the new plant is the largest single investment in Infineon's history.
Read more ...

The 2023 Symposium on VLSI Technology & Circuits
For the 43rd consecutive year delivering a unique convergence of microelectronics technology and circuits in one venue, Symposium on VLSI Technology & Circuits will resume as an in-person event in Kyoto, Japan on June 11–16, 2023.
Read more ...

Agreement Covers Complete Portfolio of Wide Band-Gap Semiconductors
The worldwide agreement will see Mouser stock Navitas GanFast and GeneSiC wide band-gap (WBG) semiconductor technologies.
Read more ...

Investment in Semiconductor Business for Electromobility
Bosch is expanding its semiconductor business with silicon carbide chips. The technology company plans to acquire assets of the U.S. chipmaker TSI Semiconductors, based in Roseville, California.
Read more ...

Digitally Integrated Ecosystem for EV Charging Solutions
ABB E-mobility announced investment in London-based, deep-tech start-up, Switch. Complementing ABB E-mobility's vertically integrated offering across smart and connected EV charging solutions, the investment represents the start of a collaboration to advance a seamless EV charging ecosystem.
Read more ...

10th Anniversary of Presence in Bulgaria
Electrical measurement technology specialist LEM is celebrating the 10th anniversary of its Bulgaria operations with the opening of a green certified office in the city center of Sofia. The 1000 sq. m site has capacity for up to 65 people, with the majority to be employed in R&D, particularly in software development.
Read more ...

EV Test Specialist Relies on Power Analyzer to Provide In Depth Analysis
The manufacturers of electric vehicles (EVs) are constantly pushing the boundaries of performance. Whether in racing cars or the everyday vehicles that consumers rely on, EV technology needs to demonstrate high efficiency, maximum range between charges, reliability and high dynamic performance.
Read more ...

Awarded Top EMEA Distributor for Second Successive Year
Avnet Abacus has been recognised by TE Connectivity (TE) as its best performing distributor for the second year running. Rudy Van Parijs, president of Avnet Abacus, was recently presented with the award at an event in Harrisburg (PA), US, by Jennifer Diener, senior vice president and general manager of TE Connectivity's Channel Business Unit.
Read more ...

EMC 'Book of Knowledge'
The 'EMC Book of Knowledge' subtitled 'Practical Tips for the User' is written by Steve Roberts, RECOM's Innovation Manager and Josefine Lametschwandler, RECOM's EMC Engineering Team Leader.
Read more ...

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Preview of Content in the June Issue

Viewpoint
Thank You Nuremberg!

Cover Story
SiC MOSFET Modules as Building Blocks for PV Systems with Integrated Storage and EV Charging

The world is facing challenges due to consequences of using fossil fuel energy sources. To address these challenges the energy sector is under transition. Transitions occur not only on the generation side of electric energy with a shift towards using more renewable energy sources, but also in the way that energy is utilised in the different sectors.
By C. Felgemacher, M. Albayrak, M. Jankovic, C. Fuentes, J. Hueskens, ROHM Semiconductor

Wide Bandgap
Improving Performance While Reducing Size and Cost with Monolithic GaN Integration

Gallium Nitride (GaN) heterojunction field effect power transistors in the 15 V to 350 V range have shown to give significant advantages over silicon in efficiency, size, speed, and cost in applications such as power conversion, motor drive, and pulsed light for lidar. These advantages are due to the critical electric field being an order of magnitude higher than in silicon, specifically a 3x advantage in band gap, and 1.3x advantage in electron mobility.
By Stephen L. Colino, V.P., Strategic Technical Sales, Efficient Power Conversion (EPC)

Design and Simulation
Advanced Inductor Circuit Models, Part II – Finding the AC Resistance

Part II of advanced inductor modeling describes how to obtain the proper ac resistance of the inductor winding. The final accurate circuit model of the inductor was found by making lab measurements of the ac resistance, which incorporates all loss mechanisms. Proximity analysis alone does not show all the measured losses.
By Dr. Ray Ridley and Mr. Art Nace, Ridley Engineering

Passive Components
Compact, Robust and Self-Shielding - Memory Inductors for Energy-Efficient Applications

The advanced series of WE-MAPI inductors combines the best possible utilization of inductance and current carrying capacity with low intrinsic losses thanks to clever material selection and manufacturing technology. New sizes extend the range of applications
By Alexander Gerfer, Chief Technology Officer, Ranjith Bramanpalli, Product Application Engineer, and Jochen Baier, Head of Technical Marketing, Würth Elektronik eiSos

Design and Simulation
Benefits and Challenges of Custom ASIC Development for Electronic Systems

An integrated circuit (IC), also known as a "chip," is a miniaturized electronic circuit comprising interconnected semiconductor components commonly made of silicon. IC technology has transformed the electronics industry by allowing a large number of electronic components to be integrated into a single chip which can then be mounted onto a printed circuit board (PCB) and connected to other chips and circuits to form a complex electronic system.
By Alexey Lebedev, Product Manager ASICs, Infineon Technologies

Power Management
Understanding Quiescent Current and Shutdown Current with a Boost Converter

For battery-powered applications, an excellent user experience depends on a long battery life and high-performance terminal devices. Quiescent current (IQ) is an important parameter to consider when optimizing these applications; in particular, an improved IQ increases battery life. This article will describe the difference between a boost converter's IQ and shutdown current (ISD) to provide a deeper understanding of how IQ and ISD can be utilized in battery-powered applications.
By Vince Wen, Product Marketing Engineer, Monolithic Power Systems (MPS)

Capacitors
Back to Basics: Capacitors

The humble capacitor, a key passive component, is an essential item used in their tens or hundreds in virtually every electronics-based design. As students, we learn their prime circuit function, but rarely do we fully appreciate some of the factors that make them become a less than ideal component. This article highlights the critical characteristics of capacitors and some of their use cases, explains the different types available, the terminology, and some of the factors that make the capacitors exhibit completely different features.
By Mark Patrick, Head of Technical Marketing, Mouser Electronics

Wide Bandgap
Variable DC-Link Voltage LLC Resonant DC/DC Converter using GaN HEMTs and SiC Diodes

The demand for efficient DC/DC converters continues to rise, with the industries focusing on optimal power consumption from the target devices. Compared to other converters, LLC resonant converters promote lower switching losses as the circuit switches the frequency at zero input voltage. Additionally, the continuous current source with minimal ripples reduces the EMI of the overall conversion.
By Saumitra Jagdale, Founder, Open Cloudware

Battery
Wireless Battery Management Systems - Enabling Smart Battery Ecosystems Solutions Through Higher Battery Performance, Greater Lifetime, and Cost Value

Electrification of passenger cars and commercial vehicles is entering a new phase of market penetration. The shift away from technology feasibility demonstration to the mass production of premium vehicles is obvious. The commercialization of technology leads to more optimized and affordable vehicles.
By Stephan Prüfling, Product Manager, Battery Management Systems, AVL, and Norbert Bieler, Director, Business Development E-Mobility, Analog Devices

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Events

Electric Machines and Drives, San Francisco, CA, USA, May 15-18 iemdc.org

ICPE ECCE Asia, Jeju, Korea, May 22-25 icpe-conf.org

European PhD School, Gaeta, Italy, May 22-26 ecpe.org/events/european-phd-school

CWIEME Berlin, Berlin, Germany, May 23-25 coilwindingexpo.com/berlin

EV Tech Expo Europe, Stuttgart, Germany, May 23-25 evtechexpo.eu

SEMICON Southeast Asia, Penang, Malaysia, May 23-25 semiconsea.org

The Battery Show Europe, Stuttgart, Germany, May 23-25 thebatteryshow.eu

ISPSD Conference, Hong Kong, China, May 28 - June 1 ispsd2023.com

Electric Vehicles Innovation Summit, Abu Dhabi, UAE, May 29-31 evinnovationsummit.com

Wireless Power Technology Conference and Expo, San Diego, CA, USA, June 4-8 ieee-wptce.org

VLSI, Kyoto, Japan, June 11-16 vlsisymposium.org

SIA Powertrain, Paris, France, June 14-15 sia.fr

Power2Drive, Munich, Germany, June 14-16 powertodrive.de

ees Europe, Munich, Germany, June 14-16 ees-europe.com

GPECOM, Cappadocia, Turkey, June 14-16 gpecom.org

IEEE CPE-POWERENG, Tallin, Estonia, June 14-16 cpepowereng2023.com

Intersolar Europe, Munich, Germany, June 14-16 intersolar.de

The Smarter E, Munich, Germany, June 14-16 thesmartere.de

Battery Electric Vehicle Architectures, Detroit, MI, USA, June 20-21 beva-usa.com

iTEC, Detroit, MI, USA, June 21-23 itec-conf.com

Automotive Power Supply Systems Week, Munich, Germany, June 26-29 automotive-iq.com

CWIEME Shanghai, Shanghai, China, June 28-30 coilwindingexpo.cn

SEMICON China, Shanghai, China, June 29 - July 1 semiconchina.org

DAC, San Francisco, CA, USA, July 9-13 dac.com

electronica China, Shanghai, China, July 11-13 electronica-china.com

SEMICON West, San Francisco, CA, USA, July 11-13 semiconwest.org

IEEE-IPFA, Penang, Malaysia, July 24-27 ipfa-ieee.org

EMC+SIPI, Grand Rapids, MI, USA, July 31 - August 4 emc2023.org

Solar PV World Expo, Guangzhou, China, August 8-10 pvguangzhou.com

World Battery Expo, Guangzhou, China, August 8-10 battery-expo.com

Asia-Pacific Power Product & Technology Exhibition, Guangzhou, China, August 8-10 bspexpo.com

Experience Power, Savannah, GA, USA, August 14-17 experience-power.com

PCIM Asia, Shanghai, China, August 29-31 pcimasia-expo.com

EPE ECCE Europe, Aalborg, Denmark, September 4-8 epe2023.com

SEMICON Taiwan, Taipei, Taiwan, September 6-8 semicontaiwan.org

PCNS, Sonderborg, Denmark, September 11-14 pcns.events

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New Products

HVIGBT Module for Inverter Systems
Mitsubishi Electric announced that it will begin shipping samples of an HV100 dual-type X-Series high-voltage insulated gate bipolar transistor (HVIGBT) module on May 31, offering superior power, efficiency and reliability in inverter systems for large industrial equipment such as railways and electric power systems.
Read more ...

FETs Pin-to-Pin Compatible With e-mode Devices
Transphorm announced the availability of six (6) surface mount devices (SMDs) available in Industry Standard PQFN 5×6 and 8×8 packages. These SMDs deliver the reliability and performance advantages offered by Transphorm's patented SuperGaN d-mode two-switch normally-off platform in the package configurations typically used by competitive e-mode GaN devices.
Read more ...

Wireless Power Transmitter IC for Charging Applications up to 50 W
Infineon Technologies expands its portfolio of wireless charging (WLC) controller ICs, offering a highly integrated, easy-to-design, and cost-effective solution for applications requiring higher wireless power transfer.
Read more ...

Reference Design Uses Controller Optimized to Drive GaN FETs
EPC and Analog Devices introduce a reference design using an Analog controller fully optimized to drive EPC GaN FETs and achieving greater than 96.5% efficiency.
Read more ...

DC Energy Meter Provides kWh-Based Charging Experience
LEM used PCIM 2023 to give the global e-mobility market advance notice of its DC energy meter for DC wallbox chargers of electric vehicles (EVs). Offering compliance to all the latest metrology regulations, the DCBM 100 energy meter will be introduced to the EU market in Q3 this year.
Read more ...

SMD Resettable PPTCs Series Created for High-Voltage Applications
The latest 3425L Series SMD PPTCs is an extension of the Littelfuse PolySwitch family of resettable overcurrent protection devices, which provides resettable, high-voltage overcurrent protection in a compact, surface-mounted 8763 mm (3425 mils) size.
Read more ...

600V Super Junction MOSFETs Family
Alpha and Omega Semiconductor announced the release of 600V aMOS7 Super Junction MOSFETs Family. aMOS7 is AOS' next generation high voltage MOSFET, designed to meet the high efficiency and high-density needs.
Read more ...

Metal Plate Shunt Resistor for Double-Sided Cooled Power Modules
ROHM developed the 12W rated metal plate shunt resistor PSR350, which is optimized for high power applications in the automotive and industrial equipment markets. ROHM will also expand the PSR lineup to include a 0.2mΩ (PSR100) model along with a 15W type (PSR330).
Read more ...

Dielectric Resonators and Ferrites Capabilities for Microwave Applications
Exxelia's E7000 series is a Ba-Mg-Ta based material that combines an ultra-high Q-factor and the possibility to get different temperature coefficients upon request. E7000 features the highest performance requested for space use in the frequency range from 5 to 32 GHz, and guarantees a Qxf up to > 250 000 at 10GHZ.
Read more ...

Battery-Protection IC Limits External Components
GLF Integrated Power  introduces an IQSmartTM battery-protection IC family, perfect for BLE (Bluetooth Low Energy) wireless earphones, hearing aids, wearables and other small, thin batterypowered devices.
Read more ...

600 V Gallium Nitride (GaN) Hybrid-Drain-Embedded Gate Injection Transistor (HD-GIT)
Infineon has announced the release of its complete portfolio of fully in-house manufactured discrete and integrated CoolGaN products, addressing power applications ranging from industrial SMPS for servers, telecom, and solar to consumer applications such as chargers and adapters, motor drives, TV/monitor, and LED lighting.
Read more ...

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