Dear Friends,

We are in that time of the year, with APEC starting next week and PCIM on the horizon. Mark your calendar for Wednesday, May 10th, when I will hold my traditional podiums discussion in Nuremberg, on the industry stage in hall 7. The GaN session will start at 1:05pm, and is followed by a SiC session, starting at 2:10pm. I have invited speakers from all the industry leaders again, you don't want to miss it!

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Bodo Arlt editor@bodospower.com

Acquisition of Canadian Gallium Nitride Pioneer
Infineon Technologies and GaN Systems announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million.
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Silicon Carbide Power Modules Selected for 800V Inverter
British engineering and technology pioneer McLaren Applied has selected STMicroelectronics as a key supplier of silicon carbide (SiC) power modules for its IPG5 800V inverter.
Read more ...

Virtual Fab Underpins Strategies to Reduce the Carbon Footprint
imec presents a quantitative assessment of the environmental impact of patterning in advanced IC manufacturing. A virtual fab has been developed in the imec.netzero modeling platform.
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Building HQ and GaN-on-SiC Epiwafer Production Facility
SweGaN is to build a headquarters including a high-capacity semiconductor production facility in Linköping. The facility will be built at the Innovative Materials Arena (IMA), a cluster for innovative materials located in Linköping in Östergötland.
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PLECS Real-Time Embedded Workshop
In the workshop from April 25th to 26th in Zurich, you will learn modeling techniques for real-time simulations using PLECS with microcontrollers and the PLECS RT Box. You will work hands-on with hardware-in-the-loop (HIL) and rapid control prototyping (RCP) application examples.
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Strengthening Sustainable Battery Industry 'Made in Germany'
Setting a sustainable course for the future of the German battery industry: The Customcells company is investing tens of millions in the expansion of its Itzehoe site in Schleswig-Holstein, Germany.
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Electronics Manufacturer Acquired
BMZ Group is pleased to announce the acquisition of VISATRONIC GmbH in the form of a strategic investment. The manufacturer of electronic flat modules, located in Mainhausen, Germany, has been a supplier to BMZ Group for many years.
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Test and Measurement Equipment from Oscilloscopes to Bench Power Supplies and Multimeters
RS Group has announced it has significantly expanded the availability of its range of products from Keysight Technologies. Keysight offers a broad range of electronic test and measurement equipment for industrial applications.
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800V Electric Vehicles Charge into the Mainstream using SiC Power Electronics
The demand for electric vehicle (EV) power electronics will increase dramatically in the next ten years, primarily driven by rapid growth in the BEV car market, where IDTechEx predicts a 15% CAGR globally over the next decade.
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APEC Industry Session Explores Dynamic Markets
The PowerSources Manufacturers Association (PSMA) Marketing Committee is organizing an Industry Session at APEC 2023 addressing the industry trends within fast growing market sectors impacting the power electronics industry. The session will take place on Wednesday afternoon, March 22nd, 2023, from 1:30 - 4:45 p.m. in Room W202BC at the Orange County Convention Center in Orlando, FL.
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Viewpoint
Wide Bandgap All the Year!

Cover Story
Consumer Drives Applications – Energy Efficiency and Power Density with SiC Power Devices

Over the past decades, energy regulations have been consolidated highlighting the importance of manufacturing energy efficient products. This has led to saving considerable amounts of energy. Additionally, these directives have paved the way for designing more innovative appliances by utilizing new technologies such as SiC MOSFETs due to their superior intrinsic properties. Adopting such technologies helps manufacturers target the highest energy class label.
By Konstantinos Patmanidis, Stefano Ruzza, Claudio Villani, Infineon Technologies

Power Modules
Power Modules in Embedded Drives

While embedded motor drives are gaining popularity in industrial applications, their compact size and tight integration present new challenges in terms of heat dissipation and electromagnetic interference. This article outlines these challenges and presents how they can be overcome using Vincotech thickfilm technology.
By Patrick Baginski, Vincotech GmbH, Unterhaching/Germany

Wide Bandgap
Easy to Use and Compact: A Family of SiC Power Modules for Automotive Traction Inverters

eMobility is rapidly gaining market share, resulting in a growing need for power electronics such as inverters. Some of the power electronics manufacturers optimize their power modules by replacing the Si IGBTs through the SiC MOSFETs in the high-volume mainstream packages. However, it is not sufficient to just replace the semiconductors. It is necessary to develop and optimize new packages which are adjusted to the SiC demands.
By Yevgeniy Temko*, Philipp Mueller, Anne Bedacht *corresponding author, all Robert Bosch GmbH

Protection
It is Easy to Drive & Protect SiC MOSFET

More than ten years ago, we started seeing increasing Silicon Carbide (SiC) Metal–Oxide–Semiconductor Field-Effect Transistors (MOSFETs) activities and a splash of product launches from key power semiconductor suppliers like Cree and Infineon. At the same time, many new suppliers were trying to dethrone the incumbent silicon and change the gameplay in their own ways. However, this is a mammoth task as Insulated-Gate Bipolar Transistors (IGBTs), which have been around for more than 40 years, are too entrenched in every power electronics engineer's design.
By Chun Keong Tee, Product Manager of Isolation Products Division, Broadcom Inc.

Thermal
A Comparative Study of the Thermal Performance of Different Die-Attach Materials Including a Preform-Based Diffusion Solder

Along with silver sintering, transient liquid phase soldering (TLPS) is considered as a replacement technology for bonding using high reliability solder alloys. Our Preforms for Diffusion Soldering PFDS400 were designed as a solution to the industrial application of TLPS technology. In this paper the thermal impedance of different variants of PFDS400 are compared with those of other die attach materials including those obtained using silver sintering to gain an insight into its thermal performance.
By Dmytro Pavlyuchkov & Ralph Mädler, Pfarr Stanztechnik GmbH

Power Quality
Power Quality Monitoring Part 1: The Importance of Standards Compliant Power Quality Measurements

This article discusses the importance of power quality (PQ) measurements in today's electric infrastructure and reviews areas of application for PQ monitoring. It will cover the IEC standard for power quality and its parameters. Finally, it summarizes the key differences between Class A and Class S power quality meters. A subsequent article will illustrate recommended solutions on "How to Design a Standards Compliant Power Quality Meter."
By Jose Mendia, Senior Engineer, Product Applications, Analog Devices

Satellite, Washington, DC, USA, March 13-16 satshow.com

SEMI-Therm, San Jose, CA, USA, March 13-17 semi-therm.org

embedded world, Nuremberg, Germany, March 14-16 embedded-world.de

APEC, Orlando, FL, USA, March 19-23 apec-conf.org

AMPER, Brno, CZ, March 21-23 amper.cz

ECPE SiC & GaN User Forum, Erding, Germany, March 28-29 ecpe.org

emv, Stuttgart, Germany, March 28-30 emv.mesago.com

Smart Systems Integration, Bruges, Belgium, March 28-30 smartsystemsintegration.com

ESARS-ITEC, Venice, Italy, March 28-31 esars-itec.org

ExpoElectronica, Moscow, Russia, April 11-13 expoelectronica.ru

productronica China, Shanghai, China, April 13-15 productronica-china.com

PAEMEET, Valencia, Spain, April 17-19 albedomeetings.com

Hannover Messe, Hannover, Germany, April 17-21 hannovermesse.de

PE International, Brussels, Belgium, April 18-19 pe-international.net

Advanced Packaging for Power Electronics, Albuquerque, NM, USA, April 18-20 imaps.org

Fortronic Power, Bologna, Italy, April 19-20 fortronic.it

Workshop on Supercapacitors, Bologna, Italy, April 19-20 supercap.org

Battery Tech Expo, Silverstone, UK, April 20 batterytechexpo.co.uk

Thermal Management Expo, Novi, MI, USA, May 1-3 thermalmanagementexpo.com

PCIM Europe, Nuremberg, Germany, May 9-11 mesago.de/en/PCIM

Sensor+Test, Nuremberg, Germany, May 9-11 sensor-test.de

SMTconnect, Nuremberg, Germany, May 9-11 smt.mesago.com

ETIP PV, Brussels, Belgium, May 10-11 etip-pv.eu

BEV Thermal Management Innovation, Palo Alto, CA, USA, May 11 battery-thermal-management-usa.com

Electric Machines and Drives, San Francisco, CA, USA, May 15-18 iemdc.org

ICPE ECCE Asia, Jeju, Korea, May 22-25 icpe-conf.org

European PhD School, Gaeta, Italy, May 22-26 ecpe.org/events/european-phd-school

CWIEME Berlin, Berlin, Germany, May 23-25 coilwindingexpo.com/berlin

EV Tech Expo Europe, Stuttgart, Germany, May 23-25 evtechexpo.eu

SEMICON Southeast Asia, Penang, Malaysia, May 23-25 semiconsea.org

The Battery Show Europe, Stuttgart, Germany, May 23-25 thebatteryshow.eu

ISPSD Conference, Hong Kong, China, May 28 - June 1 ispsd2023.com

Electric Vehicles Innovation Summit, Abu Dhabi, UAE, May 29-31 evinnovationsummit.com

Wireless Power Technology Conference and Expo, San Diego, CA, USA, June 4-8 ieee-wptce.org

VLSI, Kyoto, Japan, June 11-16 vlsisymposium.org

SIA Powertrain, Paris, France, June 14-15 sia.fr

ees Europe, Munich, Germany, June 14-16 ees-europe.com

The Smarter E, Munich, Germany, June 14-16 thesmartere.de

Power2Drive, Munich, Germany, June 14-16 powertodrive.de

Intersolar Europe, Munich, Germany, June 14-16 intersolar.de

GPECOM, Cappadocia, Turkey, June 14-16 gpecom.org

IEEE CPE-POWERENG, Tallin, Estonia, June 14-16 cpepowereng2023.com

Battery Electric Vehicle Architectures, Detroit, MI, USA, June 20-21 beva-usa.com

iTEC, Detroit, MI, USA, June 21-23 itec-conf.com

Automotive Power Supply Systems Week, Munich, Germany, June 26-29 automotive-iq.com

CWIEME Shanghai, Shanghai, China, June 28-30 coilwindingexpo.cn

SEMICON China, Shanghai, China, June 29 - July 1 semiconchina.org

DAC, San Francisco, CA, USA, July 9-13 dac.com

SEMICON West, San Francisco, CA, USA, July 11-13 semiconwest.org

electronica China, Shanghai, China, July 11-13 electronica-china.com

Reference Designs Reduce Energy Waste in Power Supplies and Battery Chargers
Pulsiv OSMIUM microcontrollers and AC to DC front-end circuit configurations are already available and now to accelerate R&D, the first in a series of reference designs has been officially launched to the market.
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Common Mode Choke Inductor
Vanguard Electronics, under the iNRCORE Family of Brands, is pleased to announce its XTCMN5 Series Common Mode Choke Inductors, the latest addition to Vanguard's growing High Temperature product line.
Read more ...

Single-Chip Intelligent Battery Management Solutions for 20-Cell Systems
Qorvo announced it has expanded its power management portfolio to include the PAC22140 and PAC25140 Power Application Controller (PAC) devices. The two PACs are the single-chip solutions to offer support for battery packs with up to 20 cells in series (20s).
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DC/DC Converters for Data-Hungry Applications 
ABB Power Conversion's DLynx III point-of-load modules provide high power density for the latest networking and data center applications including high-performance ASICs and FPGAs.
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AC-DC Active Bridge Rectifier Solution 
Alpha and Omega Semiconductor introduced an extension to its active bridge driver, AlphaZBL family. Available in an SOP-8L package, the AOZ7203AV is a self-powered dual driver IC for driving external high-voltage MOSFETs to replace two low-side diodes of bridge rectifier.
Read more ...

SiC SBDs for Data Center PSUs
ROHM has announced that Murata Power Solutions is using its silicon carbide (SiC) Schottky Barrier Diodes (SBD) to increase performance and reduce the size of Power Supply Units (PSUs) for data center applications.
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Planar Transformer Series Engineered for High Frequency, Smaller Space DC-DC Conversion Designs
Bourns introduced its Model PLN0xx-ED21 Series Planar Transformers with the advanced features needed to meet today's high frequency, smaller space power conversion application requirements.
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DC-DC Step-Up Converter for Efficient Energy Harvesting Applications
Asahi Kasei Microdevices (AKM) has launched a DC-DC step-up converter with ultra-low power consumption that is able to boost low voltages, offering solutions for remote and battery-free operation as well as low-maintenance applications in the fields of asset monitoring and IoT.
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Integrated GaN System-in-Package for USB-C PD Adapters and Other Low Power Applications
Transphorm and Weltrend Semiconductor announced the release of their first GaN System-in-Package (SiP). The WT7162RHUG24A is an integrated circuit designed for use in 45 to 100 watt USB-C PD power adapters charging smartphones, tablets, laptops, and other smart devices. It offers peak power efficiency of greater than 93%.
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High Power Density 700W Power Supplies for Medical and Industrial Applications
COSEL announced the introduction of its open-frame high power density, 700W, 3x5 inch power supply optimized for efficient cooling for use in demanding medical and industrial applications.
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In-Vehicle Network ESD Protection Portfolio for 24 V Board Net Systems
Nexperia introduced an AEC-Q101 qualified portfolio with six ESD protection devices (PESD2CANFD36XX-Q), designed to protect bus lines in automotive in-vehicle networks (IVN) such as LIN, CAN, CAN-FD, FlexRay and SENT from damage caused by electrostatic discharge (ESD) and other transients.
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High Reliability Alloy for Automotive Applications
Heraeus Electronics is pleased to announce the release of its Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste. The solder paste provides a competitive TCO offering. Based on Heraeus Electronics' proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate.
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