Bodo's WBG Expert Talk

Talk to the experts! Join my virtual roundtable, focused on wide bandgap technology. Our goal is to keep the dialog going on, independent of any events that are hosted on fixed dates. These expert talks will build on the articles we published in the magazine, giving you the chance to ask questions to the experts out of the industry.

If you are interested in participating as an expert, please plan your article for the magazine. We will then invite you to one of the upcoming rounds. Our aim is to give as many companies as possible this opportunity, as we are sure that a wide variety of contributions is of value to everyone. Different speakers will bring new perspectives and approaches.

A huge thank you goes out to all participants of our successful July edition of Bodo’s Expert Talk, of course especially to the speakers for making this such a lively discussion!

The Recordings will be published here soon.

Recordings of all previous Expert Talk sessions are now available here.

Don’t miss the current issue of the magazine – it is waiting for you in my archive!

Below you find the articles that are addressed in my last expert talk. Recordings will be available about one week after the event.

Eliminating Power Conversion Trade-Offs by Moving to 1700V SiC MOSFETs
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Download the Article:
bp_article_1923.pdf
  • SiC
  • 2022-07-27 3:00

Designers of high-voltage power systems have struggled to meet customers’ needs for continued innovation when using silicon MOSFETs and IGBTs. The desired reliability is often not possible without sacrificing efficiency, nor can silicon-based solutions meet oday’s challenging size, weight and cost requirements. With the arrival of high-voltage silicon carbide (SiC) MOSFETs, however, designers now have an opportunity to improve performance while solving all the other challenges.

By Xuning Zhang, PhD, Senior Staff Strategic Applications Engineer, Microchip Technology Kevin Speer, PhD, Senior Manager of SiC Solutions, Microchip Technology (ask-microchip@bodospower.com)

This article was published in our May 2022 issue.

SiC MOSFET Enhances Stability Under Real Application Conditions
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bp_article_1926.pdf
  • SiC
  • 2022-07-27 3:00

ROHM's 4th generation SiC MOSFETs offer improved characteristics compared to the older generation, and at lower prices. Several applications in both, the industrial and automotive sectors can benefit from this.

By Felipe Filsecker, Group Manager Application Engineer, Application and Technical Solution Center at ROHM Semiconductor Europe (ask-rohm@bodospower.com)

This article was published in our May 2022 issue.

Platform for Traction-Inverter Development Eases the Road to Future Mobility
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bp_article_1941.pdf
  • SiC
  • 2022-07-27 3:00

The momentum towards electrified mobility is gathering as governments commit to ending sales of petrol and diesel cars around the 2030 timeframe. The automotive industry, including manufacturers of trucks and buses as well as passenger or specialty vehicles, needs to solve e-powertrain design challenges quickly. However, the technology is unfamiliar and significant engineering resources and time are needed to create a properly developed solution.

By Pierre Delatte, CTO, Cissoid, and David Fresneau, VP Marketing, Silicon Mobility (ask-cissoid@bodospower.com)

This article was published in our June 2022 issue.

Benefits of Modular Approach in Medium Power Automotive Applications
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bp_article_1940.pdf
  • SiC
  • 2022-07-27 3:00

Inside automotive applications, especially for on board converters, dimension and weight are two fundamental parameters. Lighter, smaller and efficient applications as well as semiconductors and packages are crucial. For this reason, STMicroelectronics developed the ACEPACK SMIT, a top side cooling SMT package that houses the latest and efficient SiC, Super Junction and Si IGBT technologies. The aim of this article is to show the benefits deriving from the adoption of modular approach based on ACEPACK SMIT respect to the traditional trough-hole discrete one.

By Domenico Nardo, Christian Schweizer, and Manuel Gaertner, STMicroelectronics (ask-stmicroelectronics@bodospower.com)

This article was published in our June 2022 issue.

GaN vs Silicon Smackdown
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Download the Article:
bp_article_1921.pdf
  • GaN
  • 2022-07-27 4:30

One way to tell when a new technology has passed the tipping point of adoption is by the voices advocating the status quo. The more conservative voices tend to cite older information that, given the fast change of trajectory that occurs at a tipping point, can lead to oor decisions for new designs.

By Alex Lidow, CEO and Co-founder, Efficient Power Conversion (ask-epc@bodospower.com)

This article was published in our May 2022 issue.

Power Module Dynamic Test Solution Suitable Also for WBG Devices
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bp_article_1930.pdf
  • GaN
  • 2022-07-27 4:30

Evaluation of power modules is important for power electronics engineers, as well as power module manufacturers, to design efficient, small form factor, and reliable power converters. There are multiple challenges for these engineers to overcome when valuating power modules, especially for power modules made with WBG devices.

By Ryo Takeda, Michael Zimmermann, Takamasa Arai, Bernhard Holzinger, and Mike Hawes, Keysight Technologies (ask-keysight@bodospower.com)

This article was published in our May 2022 issue.

Drive Safe: Isolated Gate Drivers for High-Power Applications
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Download the Article:
bp_article_1925.pdf
  • GaN
  • 2022-07-27 4:30

New technological and market trends are constantly pushing for smaller solutions with higher power capabilities. The advancement of electric vehicles, renewable energy microgrids, massive energy storing, and high-power telecom applications have significantly increased power density requirements.

By Tomas Hudson, Applications Engineer, Monolithic Power Systems – MPS (ask-mps@bodospower.com)

This article was published in our May 2022 issue.