Bodo's WBG Expert Talk

Talk to the experts! Join my virtual roundtable, focused on wide bandgap technology. Our goal is to keep the dialog going on, independent of any events that are hosted on fixed dates. These expert talks will build on the articles we published in the magazine, giving you the chance to ask questions to the experts out of the industry.

If you are interested in participating as an expert, please plan your article for the magazine. We will then invite you to one of the upcoming rounds. Our aim is to give as many companies as possible this opportunity, as we are sure that a wide variety of contributions is of value to everyone. Different speakers will bring new perspectives and approaches.

A huge thank you goes out to all participants of our successful April edition of Bodo’s Expert Talk, of course especially to the speakers for making this such a lively discussion!

Recordings of all previous Expert Talk sessions are available here.

We look forward to the next episode, coming to you on July 26^th.
And don’t miss the current issue of the magazine – it is waiting for you in my archive!

Below you find the articles that are addressed in my last expert talk.

1200 V Discrete SiC MOSFETs with Enhanced Interconnection Technology Enable Energy Efficient Welding Machines

Download the Article:
bp_article_2028.pdf

SiC
2023-04-12 3:00

In recent years, the demand for more energy efficient products for better natural resource sustainability has led to mandatory efficiency regulations for welding machines. The improved silicon carbide CoolSiC™ MOSFET 1200 V in a TO-247 package with .XT interconnection technology and the unconventional assembly and thermal design methods offer improved designs that increase efficiency and power density.

By Jorge Cerezo, Sr. Applications Engineer, Infineon Technologies (ask-infineon@bodospower.com)

This article was published in our March 2023 issue.

Consumer Drives Applications – Energy Efficiency and Power Density with SiC Power Devices

Download the Article:
bp_article_2039.pdf

SiC
2023-04-12 3:00

Over the past decades, energy regulations have been consolidated highlighting the importance of manufacturing energy efficient products. This has led to saving considerable amounts of energy. Additionally, these directives have paved the way for designing more innovative appliances by utilizing new technologies such as SiC MOSFETs due to their superior intrinsic properties. Adopting such technologies helps manufacturers target the highest energy class label.

By Konstantinos Patmanidis, Stefano Ruzza, Claudio Villani, Infineon Technologies (ask-infineon@bodospower.com)

This article was published in our April 2023 issue.

Managing Thermals: 3 Ways to Break Through Power-Density Barriers

Download the Article:
bp_article_2022.pdf

GaN
2023-04-12 4:30

The number of semiconductors in nearly every application is multiplying, and many of the design challenges facing electronics engineers all tie back to the need for greater power density.

By Robert Taylor, Applications Engineer, Texas Instruments (ask-ti@bodospower.com)

This article was published in our February 2023 issue.

Power Packaging for the GaN Generation of Power Conversion

Download the Article:
bp_article_2027.pdf

GaN
2023-04-12 4:30

Since the launch of GaN-on-Si enhancement mode power transistors in March 2010 there has been a slow but monotonic shift towards adoption and replacement of silicon-based power MOSFETs. Initial adoption came from risk-taker visionaries in applications such as lidar, high-end audio amplifiers, robots, vehicle headlamps, and high-performance DC-DC converters.

By Alex Lidow, Michael de Rooij, and Sam Sundaram, Efficient Power Conversion (EPC) (ask-epc@bodospower.com)

This article was published in our March 2023 issue.

A Novel Half-Bridge GaN Device for Enhanced System Performance

Download the Article:
bp_article_2032.pdf

GaN
2023-04-12 4:30

Gallium Nitride (GaN) power switches continue to make inroads in diverse power conversion applications. One of the facilitators for this growth has been the responsiveness of GaN device manufacturers to diverse end-user requirements by providing targeted products that fit well into a given application.

By Asif Eqbal, Manager Design; Rajesh Ghosh, Chief Power Electronics Engineer; and Dhaval Dalal, Systems Applications Architect, Tagore Technology (ask-tagore@bodospower.com)

This article was published in our March 2023 issue.

How Thermal Efficiency Is Helping Data Centers Run More Sustainably

Download the Article:
bp_article_2035.pdf

GaN
2023-04-12 4:30

Innovative semiconductor design and packaging technologies are improving efficiencies in data centers as server power demands increase. Every time we stream the latest movie, talk to AI-driven voice assistance or attend a business meeting from home using a laptop computer, we’re pushing large amounts of digital information through data centers and using resources that consume vast amounts of electricity. And that usage is only increasing.

By Les Stark, Director of QFN and SOT Package Development, and Robert Taylor, Applications Engineer, Texas Instruments (ask-ti@bodospower.com)

This article was published in our March 2023 issue.