Dear Friends,

My team and I wish you a Happy New Year! We are more than motivated to continue delivering you your monthly high-quality publication on power electronics!

APEC show is the next important show on my calendar, I very much look forward to travelling to Long Beach and to visiting the United States again. Due to Covid, it's been a while since I've been over there and I can't wait to meet with my friends and partners in California. My February issue is going to be the show issue this year, obviously. If you want to see your material in this magazine, you better be quick and reach out to me team. As I know the schedule is tight, I convinced my team to expand the deadline for articles to January 10! Closing for advertising remains January 15, all my supporters will find their logo on the floorplan in the February issue!

For my WBG enthusiasts, I am preparing the next virtual Expert Talk for January 24. Invitations to the speakers will go out shortly. It will be the 12th edition of this format, which shows me that my audience is interested in keeping the discussion going! Watch out for further announcements on my digital channels and on the website bodospower.com/experttalk .

Find all my magazines from 2006 on in our free archive on bodospower.com.
Do not miss our Chinese version bodospowerchina.com.
There is no better way to communicate. We all share one world.
As a publisher I serve the world: one magazine, on time, every time.

Happy New Year,

Bodo Arlt editor@bodospower.com

Michael Sleven Appointed Vice President Sales Europe
Sanan Semiconductor has announced a major step towards strengthening its position in innovative, high-quality solutions with wide bandgap semiconductor materials with the appointment of renowned power electronic engineer Michael Sleven as Vice President Sales Europe.
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Financing Dedicated to Environmental Initiatives
Mitsubishi Electric Corporation announced that it has set the terms and conditions for issuing its first corporate green bonds in the Japanese market, as initially announced in a news release on November 10. The proceeds from the bonds will be used to construct a silicon-carbide (SiC) power semiconductor plant and upgrade related facilities.
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Strengthening the Scandinavian Presence
With the establishment of Würth Elektronik Danmark A/S, customers from Denmark, Greenland and the Faroe Islands now have a direct point of contact for their electronic and electromechanical component needs. Previously, these markets were also served by the Swedish subsidiary.
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Top Management of the SCHURTER Group
Lars Brickenkamp has taken over the position of CEO of SCHURTER Holding AG and has been steering the fortunes of the SCHURTER Group since December 1, 2023.
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CMOS-Compatible 200mm Process Technology
CEA-Leti has developed a 200mm gallium nitride/silicon (GaN/Si) process technology compatible with CMOS cleanrooms that preserves the high performance of the semiconductor material and costs less than existing GaN/SiC technology.
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One of the Most Sustainable Companies Globally
Infineon Technologies has once again been included in the Dow Jones Sustainability World Index, as announced by S&P Global last Friday in New York, USA. Infineon is well on track with the implementation of its CO₂-neutrality goal by 2030 (Scope 1 and 2).
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Peter Henry Appointed to Board of Directors
Analog Devices announced that its Board of Directors has appointed Dr. Peter B. Henry as an independent director and member of the Board's Audit Committee effective December 5, 2023. Dr. Henry is currently the Class of 1984 Senior Fellow at the Hoover Institution and Senior Fellow at the Freeman Spogli Institute for International Studies, both at Stanford University.
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Opening Ceremony and Investor Day at Torrance HQ
Navitas Semiconductor held an Opening Ceremony and 2023 Investor Day at its new headquarters in Torrance, CA on Tuesday, December 12th. Torrance Mayor, George Chen, and Dustin McDonald from the Office of the Governor of California joined Navitas' CEO and co-founder Gene Sheridan to speak and cut the ribbon, officially opening Navitas' headquarters.
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APEC 2024 Plenary Session Features Renowned Industry Experts
The annual Applied Power Electronics Conference will mark its 2024 event with an opening Plenary Session on Monday afternoon, February 26. The four-hour session will consist of six presentations delivered by visionaries representing industry and academia addressing topics of interest and concern to engineers engaged in applied power electronics technology.
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Nanocrystalline Soft Magnetic Materials Tested in the OBC
As part of a joint international research project with CBMM, innolectric has published a study on increasing the efficiency of charging components using nanocrystalline magnetic materials. Innovative soft magnetic cores with niobium were analyzed in direct application in the innolectric On-Board Charger.
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Donation for Educational Initiative
Vincotech is carrying on its holiday tradition of donating to a good cause in lieu of sending gifts to customers. The company's partner in philanthropy, Plan International Germany, is to receive a €12,000 grant from Vincotech on behalf of its workforce and customers.
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SGRE, Doha, Qatar, January 8-10 sgre-qa.org

CES, Las Vegas, NV, USA, January 9-12 ces.tech

DesignCon, Santa Clara, CA, USA, January 30 - February 1 designcon.com

India Electronics Week, Bengaluru, India, January 31 - February 2 indiaelectronicsweek.com

Advancements in Thermal Management, Orlando, FL, USA, February 13-15 thermalconference.com

Intersolar India, Gujarat, India, February 20-23 intersolar.in

APEC, Long Beach, CA, USA, February 25-29 apec-conf.org

IEEE AMC, Kyoto, Japan, February 28 - March 1 IEEE AMC2024

ENERGYCON, Doha, Qatar, March 4-7 ieee-energycon2024.com

Thermal Management for EV/HEV, Munich, Germany, March 5-7 automotive-iq.com

ISS Europe, Vienna, Austria, March 7-8 semi.org/ISS-EU

PLECS Conference, Zurich, Switzerland, March 12-13 plexim.com

emv, Cologne, Germany, March 12-14 emv.mesago.com

CIPS, D³sseldorf, Germany, March 12-14 cips.eu

Satellite, Washington, DC, USA, March 18-21 satshow.com

Device Packaging Conference, Fountain Hills, AZ, USA, March 18-21 devicepackaging.org

AMPER, Brno, CZ, March 19-21 amper.cz

productronica China, Shanghai, China, March 20-22 productronica-china.com

SEMICON China, Shanghai, China, March 20-22 semiconchina.org

SGSMA, Washington, DC, USA, March 21-23 seas-sgsma2024

SEMI-Therm, San Jose, CA, USA, March 25-29 semi-therm.org

IPC APEX, Anaheim, CA, USA, April 6-11 ipcapexexpo.org

embedded world, Nuremberg, Germany, April 9-11 embedded-world.de

PE International, Brussels, Belgium, April 16-17 pe-international.net

ExpoElectronica, Moscow, Russia, April 16-18 expoelectronica.ru

Hannover Messe, Hannover, Germany, April 22-26 hannovermesse.de

Battery Tech Expo, Silverstone, UK, April 25 batterytechexpo.co.uk

Power Electronics Expo, Silverstone, UK, April 25 powerelectronicsexpo.co.uk

Thermal Management Expo NA, Novi, MI, USA, April 30 - May 1 thermalmanagementexpo.com

Motor Driver ICs Enable Full Torque at Zero Speed for Sensorless BLDC Motors
Renesas Electronics introduced a family of motor driver ICs for brushless DC (BLDC) motor applications. The devices implement Renesas' patent-pending technologies that enable full torque at zero speed from motors without sensors.
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Portfolio of Space-Screened GaN HEMTs
Teledyne e2v HiRel announces the addition of new space screened versions of its popular 100 V, 90 A and 650 V, 30 A high reliability gallium nitride high electron mobility transistors (GaN HEMTs). The parts go through NASA Level 1 or ESA Class 1 screening flow and can be brought up to full Level 1 conformance with extra qualification testing if desired.
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GaN FETs in Compact SMD Packaging
Nexperia announced that its GaN FET devices, featuring high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications. Building on two decades of expertise in supplying high-volume, high-quality copper-clip SMD packaging, Nexperia is now proud to extend its packaging approach to GaN cascode switches in CCPAK.
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HEMT Family in Easy-to-Use Flip Chip QFN Packaging
Innoscience Technology has announced a range of low voltage discrete HEMTs in FCQFN packaging. Rated at 40 V, 100 V and 150 V, the 'flip chip' formatting makes it simple for engineers to use.
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160 V 2-Channel Gate Driver ICs for Battery-Powered Applications
Infineon Technologies announced the expansion of its MOTIX™ family of products for automotive and industrial motor control applications. To further expand the advanced product family, Infineon introduces the 2-channel MOTIX gate driver ICs 2ED2742S01G, 2ED2732S01G, 2ED2748S01G, and 2ED2738S01G.
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Microcontrollers Reduce Noise, Vibration and System Harshness in BLDC Applications
Microchip Technology has launched its AVR EB family of microcontrollers (MCUs) to offer a solution for addressing NVH and efficiency in a wide variety of cost-sensitive applications.
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 eFuses Feature Continuous Current up to 100 A
DigiKey announced that the EFUSE-48V100A reference design product from Vishay is now available for purchase globally from DigiKey. The Vishay eFuse features TrenchFET MOSFETs and is designed to handle continuous current up to 100 amps.
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Gate Drivers for 62 mm SiC and IGBT Modules
Power Integrations announced a family of plug-and-play gate drivers for 62 mm silicon-carbide (SiC) MOSFET and silicon IGBT modules rated up to 1700 V, with enhanced protection features to ensure safe, reliable operation.
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1200V Hermetically Sealed Silicon Carbide Half-Bridge Power Module
Solitron Devices is pleased to announce the introduction of the SD11487, a hermetically sealed Silicon Carbide (SiC) Power Module for high reliability applications. With a hermetic packaging format, the 51mm x 30mm x 8mm outline is the smallest hermetically sealed high reliability, high voltage, half-bridge on the market.
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AC-DC Power Supplies for Industrial, IoT, and EV Applications
CUI announced the addition of three, chassis mount ac-dc power supplies housed in compact metal cases with the VGS-500, VGS-350D, and VGS-200E series line of products. The ultra-slim designs make the power supplies appropriate for industrial and IoT use in harsh environments for inductive load applications such as motors, relays, and contactors.
Read more ...

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