Dear Friends! Next week, we’ll meet at PCIM in Nuremberg, and I’m really looking forward to it. Sure, it’s the summer edition of the event, and we all know it can get quite warm around that time of year. But the halls are air-conditioned, and great Franconian beer tastes best when you’re truly thirsty after a busy trade show day. That also applies to the non-alcoholic version, which, by the way, is the most popular one within our team.

Still, the "Feierabendbier" has to be earned. Three days are not much time to cover six exhibition halls, so preparation is essential if you want to make the most efficient use of your schedule. Perhaps the floor plan in the centerfold of my magazine can help you find a particular exhibitor. The magazine will be available at the entrances, at the trade press booth, and of course at my booth in Hall 4.

This year, my WBG panel is split across two days. On Wednesday, you can get your update on silicon carbide during two sessions at the Technology Stage in Hall 4-139. We’ll begin at 13:25, make sure to check out the speaker lineup on the program site. Then on Thursday, at the same stage, we’ll bring you the latest developments in gallium nitride. That session starts at 11:45, and you can find the full program details at the same link.

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time. Kind Regards, Bodo Arlt
Please add our address newsletter@bodospower.de to your approved sender list to ensure inbox delivery. View online version
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On time postal delivery and here is the June issue ready for download.

(current issue)

Dear Friends,

Next week, we’ll meet at PCIM in Nuremberg, and I’m really looking forward to it. Sure, it’s the summer edition of the event, and we all know it can get quite warm around that time of year. But the halls are air-conditioned, and great Franconian beer tastes best when you’re truly thirsty after a busy trade show day. That also applies to the non-alcoholic version, which, by the way, is the most popular one within our team.

Still, the "Feierabendbier" has to be earned. Three days are not much time to cover six exhibition halls, so preparation is essential if you want to make the most efficient use of your schedule. Perhaps the floor plan in the centerfold of my magazine can help you find a particular exhibitor. The magazine will be available at the entrances, at the trade press booth, and of course at my booth in Hall 4.

This year, my WBG panel is split across two days. On Wednesday, you can get your update on silicon carbide during two sessions at the Technology Stage in Hall 4-139. We’ll begin at 13:25, make sure to check out the speaker lineup on the program site. Then on Thursday, at the same stage, we’ll bring you the latest developments in gallium nitride. That session starts at 11:45, and you can find the full program details at the same link.

Find all magazines from 2006 on in the free archive on my website. Do not miss our Chinese version bodospowerchina.com. There is no better way to communicate. As a publisher I serve the world: one magazine, on time, every time.

Kind Regards,

Bodo Arlt
editor@bodospower.com

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e-Newsletter Content - just click and get to your topic:
The News
- APEC 2027: Call for Technical Sessions Digest Submissions
- All Battery New Energy Vessel in China
- Distribution Agreement for GaN Devices
- EU flagship Project Moore4Power to drive the next Generation of sustainable Power Electronics
- Acquisition of Power Semiconductor Company
- Announcing 3D-PEIM 2026 Tutorial and Panel Session
- Swiss Company acquires Chinese Developer of high-voltage Circuit Protection Solutions
Events
New Products
- SMT Current Sense Transformers
- High-Power Modules for High-Voltage Energy Systems
- Liquid-Cooled 3-Phase AC/DC Converters for High-Power Industrial Applications
- Isolators for Galvanic Isolation of Digital Signals
- 80 V N-channel MOSFET support 48 V Automotive Systems
- Scalable Power Supply Solutions for Automotive SoCs
- Non-isolated Buck-Boost DC/DC Converters with up to 99 % Efficiency
- Gate Driver ICs for three-phase brushless Motors
- Total Power Solution for Panther Lake and Wildcat Lake Platforms
- Copper Nano-Paste for pressureless Die Attach in Power Semiconductors

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The News

APEC 2027: Call for Technical Sessions Digest Submissions
APEC 2027, to be held in New Orleans, Louisiana/USA, from March 7-11, 2027, is now accepting digest submissions for the Technical Sessions. Interested authors wishing to present a Technical Session paper must submit a digest for consideration by August 14, 2026.
Read more ...

All Battery New Energy Vessel in China
Dukosi announces the launch of China’s first all-battery new energy vessel equipped with the Dukosi Cell Monitoring System (DKCMS®). The all-battery vessel features a contactless battery management system (BMS) developed by Guangxi Yichuan Intelligent Technology.
Read more ...

Distribution Agreement for GaN Devices
Efficient Power Conversion (EPC) announced a global distribution agreement with Mouser Electronics. This partnership will see Mouser Electronics distribute EPC’s complete portfolio of eGaN® FETS and ICs.
Read more ...

EU flagship Project Moore4Power to drive the next Generation of sustainable Power Electronics
Europe has launched an ambitious semiconductor R&D project involving 62 partners: Moore4Power (More than Moore for Disruptive Innovations in Power Electronics). Led by Infineon Technologies this chips joint undertaking initiative unites large entities, small and medium-sized enterprises and research institutes from 15 European countries to develop the next generation of smart, efficient and sustainable power electronics.
Read more ...

Acquisition of Power Semiconductor Company
Analog Devices, and Empower Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Empower in an all-cash transaction for $1.5 billion.
Read more ...

Announcing 3D-PEIM 2026 Tutorial and Panel Session
3D-PEIM 2026, an international symposium dedicated to 3D power electronics packaging and heterogeneous integration, will take place November 16–19, 2026, at Arizona State University in Tempe, Arizona. The symposium will bring together researchers, manufacturers, and industry leaders to discuss emerging technologies and manufacturing approaches shaping the future of advanced power packaging.
Read more ...

Swiss Company acquires Chinese Developer of high-voltage Circuit Protection Solutions
SCHURTER has completed its acquisition of Biaodi, a China-based developer of high-voltage circuit protection solutions for electric vehicles and new energy applications.
Read more ...

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Events

IPEC ECCE Asia, Nagasaki, Japan, May 31 - June 4 ipec2026.org

European EV Thermal Management Summit, D³sseldorf, Germany, June 2-3 EuropeanEVThermalManagement

GPECOM, Naples, Italy, June 3-5 gpecom.org

GaN Marathon, Florence, Italy, June 7-10 ganmarathon.com

EV Tech Expo Europe, Stuttgart, Germany, June 9-11 evtechexpo.eu

PCIM Expo & Conference, Nuremberg, Germany, June 9-11 mesago.de/PCIM

Sensor+Test, Nuremberg, Germany, June 9-11 sensor-test.de

The Battery Show Europe, Stuttgart, Germany, June 9-11 thebatteryshow.eu

Coiltech North America, Novi, MI, USA, June 10-11 quickfairs.net

iTEC, Novi, MI, USA, June 10-12 itec-conf.com

VLSI, Honolulu, HI, USA, June 14-18 vlsisymposium.org

SIA Powertrain, Lille, France, June 17-18 sia.fr

PEDG, Vi±a del Mar, Chile, June 21-24 pedg2026.com

Intersolar Europe, Munich, Germany, June 23-25 intersolar.de

Power2Drive, Munich, Germany, June 23-25 powertodrive.de

The Smarter E, Munich, Germany, June 23-25 thesmartere.de

ees Europe, Munich, Germany, June 23-25 ees-europe.com

CWIEME Shanghai, Shanghai, China, June 24-26 coilwindingexpo.cn

CPE-PowerENG, Ningbo, China, June 29 - July 1 cpe-powereng-2026

electronica Shanghai, Shanghai, China, July 1-3 electronica-china.com

WPTCE, Halifax, Canada, July 6-9 ieee-wptce.org

Battery Cells & Systems Expo, Birmingham, UK, July 8-9 batterysystemsexpo.com

Vehicle Electrification Expo, Birmingham, UK, July 8-9 ve-expo.com

IEEE IPFA, Singapore, July 13-16 ipfaieee.org

DAC, Long Beach, CA, USA, July 26-29 dac.com

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New Products

SMT Current Sense Transformers
The CSX7030 series from Coilcraft is a high-isolation, low-loss current sensing transformer designed for high-performance power electronics and automotive applications. It features a chip-style package with a low 3.3 mm profile and is manufactured using a highly automated process to ensure consistent quality and cost efficiency.
Read more ...

High-Power Modules for High-Voltage Energy Systems
Infineon Technologies expands its XHP™ 2 power module portfolio with variants incorporating CoolSiC™ MOSFETs 2300 V, designed for high-voltage power systems. These 2300 V class devices support DC-link voltages of up to 1500 V, addressing the industry trend toward higher system voltages.
Read more ...

Liquid-Cooled 3-Phase AC/DC Converters for High-Power Industrial Applications
Bel Fuse launched its TLP5000 Series of liquid-cooled, high-power 3-phase AC/DC converters designed to meet the growing demands of industrial systems operating in extreme conditions. Built for applications such as high-power laser cutting, winding machines, and spinning mills, the platform delivers the reliability and robustness engineers need in demanding environments.
Read more ...

Isolators for Galvanic Isolation of Digital Signals
Würth Elektronik is expanding its range of digital isolators (WPME-CDIS & WPME-CDIP) with 2-channel bidirectional isolators for I2C communication interfaces. WPME-CDI2C enables bidirectional data transmission at up to 2 MHz, making the isolator suitable for most I2C communication applications.
Read more ...

80 V N-channel MOSFET support 48 V Automotive Systems
Toshiba Electronics Europe introduced two AEC-Q101 compliant 80 V N-channel MOSFETs supporting 48 V automotive systems. The XPH2R608QB and XPH3R908QB are the first products from the latest-generation U-MOSX-H process to be housed in the SOP Advance (WF) package with wettable flanks.
Read more ...

Scalable Power Supply Solutions for Automotive SoCs
ROHM has developed a configurable power supply solution that combines the PMIC BD968xxC Series with the DrMOS BD96340MFFC, targeting automotive SoCs. This solution was developed based on a "Configurable" design concept enabling flexible adaptation to a wide range of SoC power requirements.
Read more ...

Non-isolated Buck-Boost DC/DC Converters with up to 99 % Efficiency
The TDK-Lambda i9C series is a 1500 W non-isolated DC/DC buck-boost power module designed to maximize system efficiency, reduce thermal stress, and extend battery runtime in demanding industrial and battery-powered applications. The i9C series launches with a 9 – 80 V input, 9.6 – 60 V output model delivering up to 30 A.
Read more ...

Gate Driver ICs for three-phase brushless Motors
STMicroelectronics has introduced additional STDRIVE102 gate-driver ICs for three-phase brushless motors, adding the STDRIVE102P and STDRIVE102BP that feature an SPI interface to simplify configuring the gate current and other settings. Designed for supply voltages from 6 V to 50 V, the STDRIVE102 series enables energy efficiency in battery-operated equipment such as power tools and domestic appliances.
Read more ...

Total Power Solution for Panther Lake and Wildcat Lake Platforms
Alpha and Omega Semiconductor (AOS) announced a family of digital multiphase controllers: the AOZ71049QI, AOZ71149QI and AOZ71146QI. Specifically engineered for Intel IMVP9.3 Vcore power delivery, these 4-rail controllers - when paired with AOS’s benchmark DrMOS and Smart Power Stage (SPS) technology - provide a complete power solution for the latest Intel Panther Lake and Wildcat Lake mobile processor architectures.
Read more ...

Copper Nano-Paste for pressureless Die Attach in Power Semiconductors
Elephantech has added SAphire™ D02 to its SAphire™ low-temperature sintering copper nano-paste lineup, designed for pressureless die attach applications. This enhances manufacturing process flexibility and addresses thermal management issues in the power semiconductor field, including not only die attach but also Thermal Interface Materials (TIMs).
Read more ...

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