Page | Article |
12 | Product Highlights from APEC 2025 |
20 | DC and Energy Stress Tests up to 4KV |
22 | Gen 4 Technology Platform delivers “Flexibility without Compromise” |
24 | Compact SiC Module for High Power Density On-Board Chargers |
28 | Revolutionizing power electronics: GaN bidirectional switches |
32 | Increasing Power Density using Low Voltage eGaN FETs in High-Voltage Sever Power |
36 | Web Simulation: Broadening Access to Power Electronics Modeling |
40 | Traction Inverter Functional Safety Design with SiC-Based Auxiliary Power Supply |
44 | Augmenting Car Sustainability with Flexible and Intelligent Power Control |
48 | Optimal Efficiency Enabled by New Generation Super-Junction MOSFETs in Refrigerator Compressor Drives |
52 | Powering the SiC Revolution with Vertical Integration |
56 | Super Clamp TVS – Solution with extremely low Clamping Ratio |
58 | Market leader for more than 30 years for HVDC rated IGBTs |
60 | Direct Determination of Traction Inverter High-Frequency Power Losses with Innovative Power Analysis Technology |
66 | Bi-Directional GaN Switches: Power Conversion with Single- Stage BDS Converters |
70 | Driving Innovation in Power- Supply designs with integrated TOLL-packaged GaN Devices |
74 | Enabling Smarter DC Link Discharge in EV Traction Inverters |
76 | Optimizing Efficiency: Exploring an Active Clamp Forward Converter’s Secondary Rectified Circuit Design and Duty Cycle Role |
80 | 11th ECPE SiC & GaN User Forum |
82 | Taiwan was Frontrunner of International Exhibitors at Embedded World |