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Lifetime Modelling and Simulation of Power Electronics Components and Systems
ECPE announces the Workshop at the University of Applied Sciences, Dusseldorf, on July 3-4, 2013. 24 engineers and scientists from industry and academia will present and discuss the most recent results in this field. The programme includes sessions like: mission profile, active and passive devices, interconnects: bond wires and die attach, power modules, systems on PCB, and environmental stresses.
http://www.ecpe.org
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